Bent CPU Socket LGA fil akan Intel ko AMD AM5 Motherboard, ko AM4 CPU Ripped Out Stack to Heatsink: Razor Blade da Dental Pick Realignment¶

'Yan lokuta kaɗan yayin ginin kwamfuta na al'ada ko haɓakar manna mai zafi yana haifar da firgita kai tsaye fiye da ɗaga murfin soket ɗin kariya na filastik ko cire mai sanyaya CPU da ganin ko dai tarin gwal na lanƙwasa gwal a cikin Intel. LGA 1700,Intel LGA 1851ko AMD AM5 motherboard soket, ko gano cewa AMD ku AM4 Pin Grid Array (PGA) processor an fiddo kai tsaye daga cikin kulle Zero Insertion Force (ZIF) soket yayin da har yanzu ana siminti zuwa kasan heatsink na aluminium. Ƙaddamar da uwa a lokacin da madaidaicin Land Grid Array (LGA) na cantilever spring fil suna taɓawa ko lokacin da babban halin yanzu VCC An ketare fil ɗin wuta zuwa cikin ƙasa VSS ko kushin mai kula da ƙwaƙwalwar ajiya na iya aika halin yanzu mara tsari ta hanyar injin sarrafawa, yana ƙone kushin lamba ta dindindin akan uwa da kuma CPU a cikin milliseconds. Idan gajeriyar soket na CPU mai kuzari yana haifar da tartsatsin gani, hayakin kone-kone, ko wutar lantarki a cikin akwati na kwamfutarka, kashe wutar lantarki ta baya, cire igiyar bangon canji (AC) nan da nan, kuma kira yankin ku. lambobin gaggawa. Don abubuwan gaggawa na kayan aikin kwamfuta masu alaƙa, duba jagororin mu akan CPU soket thermal manna zube da makale heatsink, Ruwan ƙarfe thermal fili gallium yana zubewa akan abubuwan haɗin uwa, kuma M.2 NVMe SSD ya ɓace PCB mai lankwasa da makale heatsink ceto.

Duk da yadda bala'i na ɓarna na ɓangarorin ƙwanƙwasa microscopic ko skewed jere na AMD Ryzen processor fil suna kallon tsirara, jan ƙarfe-beryllium (CuBe) da phosphor-bronze gami da aka yi amfani da su a cikin haɗin haɗin gwiwar CPU na zamani an yi su don karkatar da lokacin bazara kuma suna da babban ductility kafin raunin aiki-hardening ya faru. Muddin ba za ku taɓa kulle na'ura mai sarrafawa a kan fitilun LGA da aka lanƙwasa ba don gwadawa idan ya yi takalmi, kada ku taɓa fitar da injin AM4 mai siminti a kashe heatsink mai sanyi tare da screwdriver, kuma yi amfani da hasken raking na jagora 5x ku 10x girman macro na wayoyoniya, da kayan aikin daidaita ƙananan injiniyoyi irin su fanko 0.5 mm (0.020-inch) tip ɗin fensir na inji, bakararre 28G ku 30G allurar sirinji insulin, ko a 0.10 mm (0.004-inch) Bakin carbon karfe reza ruwa guda ɗaya, za ku iya mayar da duka Land Grid Array motherboard sockets da Pin Grid Array na'urori zuwa ci gaban wutar lantarki.

Yi wannan yanzu¶

1. Kada a matsa CPU zuwa soket tare da lanƙwasa fitin LGA ko kunna wutar lantarki. Kulle lever ɗin yana aiki. 350 to 490 Newtons (80 to 110 pounds-force) na ƙarfi a tsaye a fadin murfi mai sarrafawa. Idan an lankwasa LGA 1700, LGA 1851, ko AM5 fil fil yana ninke daga matsayi, clamping CPU yana murƙushe tip ɗin zinare kuma yana iya gajeriyar a 1.3V VDDCR ko VCCIA core ikon dogo kai tsaye zuwa cikin a 0.8V sigina pad a kan processor.
2. Kada a taɓa goge ko goge soket ɗin motherboard na Intel LGA ko AMD AM5 da aka fallasa tare da kyalle, tawul ɗin takarda, ko swab ɗin auduga. Duk wani fil da ke cikin soket ɗin LGA yana da siffa mai kama da ƙugiyar kifi da ke da kusurwa 30 zuwa 45. Jawo zaren auduga guda ɗaya a cikin jeri yana ƙulla ɗimbin shawarwarin bazara masu lafiya kuma yana mayar da su baya.
3. ** Idan an ciro na'urar sarrafa AMD AM4 daga soket ɗin motherboard ɗin da ke makale a ƙasan na'urar sanyaya CPU, saita mai sanyaya juye-sau (filin CPU ɗin yana fuskantar rufi) akan tebur mai tsayi nan da nan.
4. ** Bincika soket ɗin da aka lalace ko na'ura mai sarrafawa daga kusurwoyi huɗu na kamfas ta amfani da fitilar LED wanda ke riƙe a kusurwar raking mai digiri 15 yayin kallo ta hanyar 5x ku 10x kyamarar macro na wayar hannu akan faifan gefe guda.** Hasken gefen gefe yana sa kowane tip ɗin da ba daidai ba yana haskaka haske ko jefa tazara mai duhu a kan grid ɗin uniform.
5. ** Ɗauki babban hoto macro na lanƙwasa fil ɗin kuma bincika Intel na hukuma LGA 1700 / 1851 ya da AMD AM5 zanen pinmap soket kafin a taɓa kowane fil.** Sama da kashi 30 na 1,700 to 1,851 fil a cikin soket na CPU na zamani ba su da yawa Ground (VSS) fil ko Ajiye (RSVD) pad. Idan fil guda ɗaya aka cire a tsafta kuma baya taɓa maƙwabta, duba taswirar yana nuna maka ko allon zai gudana akai-akai ba tare da sa hannun jiki ba.
6. ** Matsar da fitilun LGA ko PGA a cikin sannu a hankali (0.1 mm ku 0.2 mm) a kishiyar hanyar lanƙwasawa.** ƙarfen marmara na Copper-beryllium yana fama da taurin aiki idan an lanƙwasa gaba da gaba akai-akai. Ɗayan da aka sarrafa shi ya koma cikin jeri na grid yana kiyaye ƙarfin fil, yayin da murɗa fil ɗin sau uku yana kashe shi.

Bishiyar yanke shawara: Triaging Intel LGA 1700/1851, AMD AM5, da makalewar gaggawa na AMD AM4¶

flowchart TD
    A["Socket ko Processor Pin Emergency"] --> B{"Wanne CPU da Socket Architecture?"}
    B -->|"Intel LGA 1700/1851 ko AMD AM5 (Pins a Motherboard)"| C{"Yanayi na lankwasa fil LGA a ƙarƙashin macro 10x?"}
    C -->|"1 zuwa 8 fil skewed ko zaune ƙasa da ƙasa"| D["Hana waya akan tripod a zuƙowa 10x tare da hasken digiri 15 -> Yi amfani da allurar 30G a ƙarƙashin gwiwar hannu -> Nudge cikin grid"]
    C -->|"Tip ɗin da aka naɗe da digiri 180 ko an ɗaure shi"| E["Slip 30G allura a ƙarƙashin madauki -> Ɗaga 0.3 mm don share maƙwabci -> Jagorar cantilever gaba tare da hatsi"]
    C -->|"Fitin 1 an cire shi da tsafta a gindi"| F["Keɓance stub -> Bincika daidaitawar X/Y akan Taswirar Pinout -> Idan VSS ko RSVD, yi tata lafiya; idan mai mahimmanci, maye gurbin soket"]
    C -->|"Filaye 15+ da aka murƙushe ta kayan aikin da aka sauke"| G["Tsaya DIY -> Yi amfani da ASUS / MSI / Gigabyte / ASRock Sabis na Maye gurbin Socket ($ 50 zuwa $ 120)"]
    B -->|"AMD AM4 PGA (Pins a kan kasa na CPU)"| H{"Shin AM4 CPU ya makale akan Heatsink?"}
    H -->|"Ee: An fitar da siminti zuwa mai sanyaya"| I["Juya mai sanyaya -> Heatsink mai zafi zuwa 65 C na 3 min -> Drip 99% IPA -> Gani tare da floss na hakori -> Twist CPU gefuna 15 deg"]
    H -->|"A'a: Ware, lanƙwasa fil"| J{"Yaya munin tsayayyen fil ɗin PGA ke lankwasa?"}
    J -->|"An karkatar da 10 zuwa 45 digiri"| K["Zamewa ruwan reza mai baki ɗaya ko katin kiredit tare da tashoshi na X/Y -> Yi amfani da tip ɗin fensir mara kyau na mm 0.5"]
    J -->|"Fassara 80 zuwa 90 digiri"| L["Tushen fil mai dumi (55 C) -> Taga zuwa 45 deg tare da ruwa # 11 -> Gama a tsaye tare da fensir na inji 0.5 mm"]

Sashe na 1: fahimtar LGA cantilever spring makanikan vs. PGA m fil¶

1. Land Grid Array (LGAkafa: Intel LGA 1700, LGA 1851, LGA 1200da AMD AM5 (LGA 1718)¶

A cikin Intel na zamani da AMD Ryzen 7000/8000/9000 (Socket AM5) Motherboards, processor ɗin yana da fakitin tuntuɓar gwal a ƙasa, yayin da * 1,700 zuwa 1,851 spring fil suna zaune a cikin soket na uwa ***:

+---------------------------------------------------------+
|  INTEL LGA 1700/1851 OR AMD AM5 CANTILEVER SOCKET PIN   |
|          CPU Gold Contact Land (Presses Down)           |
|                 =======================                 |
|                          *  <-- 0.15 mm Contact Tip     |
|                        /   <-- Upper Arm (Angled 35 deg)|
|     Spring Elbow -->  (                                 |
|                         \  <-- Lower Base Beam          |
|  ========================|========================      |
|  LGA Plastic Socket Floor (0.4 mm to 0.8 mm Pitch)      |
+---------------------------------------------------------+

• ** Girman ƙananan ƙananan: ** Kowane fil LGA an buga shi daga zinari-plated jan karfe-beryllium (CuBe) ko phosphor-tagulla mai aunawa ** 0.08 millimeters zuwa 0.12 millimeters (0.003 zuwa 0.005 inci) mai kauri ***, sarari akan 0.4 mm x 0.8 mm rawa.
• ** Hatsi Quadrant Hatsi:** Lafiyayyen Intel ko AMD AM5 soket ya bayyana ya kasu kashi ** rabi biyu ko quadrants huɗu ** waɗanda ke nuna haske daban-daban saboda cantilever mai kusurwa yana tsiro a kishiyar halves yana nunawa a gaban kwatance don daidaita ƙarfin zafi na kwance.
• Me yasa Tura Kai tsaye Yana Rusa Pin LGA: Fitin LGA yana matsawa a tsaye ta 0.25 millimeters lokacin da lebur CPU kushin ya danna ƙasa. Dauke fil ɗin da aka lanƙwasa guda ɗaya kai tsaye zuwa ƙasa yana rushe gwiwar gwiwar bazara a ƙasan fil ɗin da ke kewaye, yana haifar da ** buɗe da'irar ***.

2. Pin Grid Array (PGAProcessor: AMD Socket AM4 (Ryzen 1000/2000/3000/5000)¶

• ** Rubutun Silindrical masu ƙarfi akan CPU:** Fil ɗin tagulla mai ɗorewa ** 1,331 madaidaiciyar zinare *** an yi su ne a ƙasan koren fiberglass processor substrate a cikin 1.00 millimeter (0.039-inch) orthogonal (X/Y) grid, kowane aunawa 0.32 millimeters (0.0126 inches) kauri kuma 3.0 millimeters (0.12 inches) tsayi.
• ** Me yasa AM4 CPUs ke Rikewa Daga Rubutun Kulle:** Ba kamar soket ɗin LGA ba (wanda ke danne kunnuwa a ƙarƙashin firam ɗin ƙarfe), AMD AM4 soket na ZIF ba shi da babban babban sashi mai riƙe da gefuna na CPU ƙasa. Lokacin da thermal manna ya warke sama da shekaru 2 zuwa 4 cikin busasshen siminti tsakanin 38 mm x 38 mm Murfin CPU da tushe mai sanyaya, ja sama akan na'ura mai sanyaya yana shawo kan gogayya ta soket na ciki, yana yage na'ura mai sarrafa kai tsaye daga rufaffiyar soket.

Kashi na 2: Ceto-mataki-mataki don AMD AM4 CPU ya tsage makale zuwa heatsink¶

Mataki 1: Tsare na'urar sanyaya jujjuyawar kuma duba filayen kewaye¶

1. Juya mai sanyaya CPU juye-sau don haka ** fil ɗin zinare na madaidaicin mai sarrafa AM4 a tsaye sama **, kuma a ɗaure heatsink a cikin akwati ko tawul ɗin birgima akan tebur.
2. Kada a sake tura CPU ɗin da ke makale da na'urar sanyaya sanyaya zuwa cikin rufaffiyar soket ɗin uwa. Ana rufe faranti na cam na ciki kuma za su murkushe fil akan lamba.
3. Jira har sai **bayan ** cire processor daga heatsink kafin daidaita fitilun lanƙwasa, don haka yatsun ku za su iya riƙe gefuna na fiberglass a amince a lokacin cirewa.

Mataki 2: Hanyar "65-Degree Hairdryer + Isopropyl Alcohol + Dental Floss Twist" Hanyar¶

Kada a taɓa yin ƙugiya tsakanin koren fiberglass CPU substrate da ginin heatsink na ƙarfe tare da screwdriver ko wuƙa.

1. ** Kewaye Heatsink Tare da Tawul masu Lauyi:** Kunna tebur a kusa da mai sanyaya don haka CPU ya faɗi ƙasa a hankali idan manna ya fito kwatsam.
2. ** Zafin Heatsink Base da Rufin CPU zuwa 60 zuwa 70 Digiri Celsius (140 zuwa 158 Degree Fahrenheit):** Nufin mai bushewar gashi akan ** Babban Zafi *** 5 centimeters (2 inches) daga tushen heatsink na jan karfe da murfin CPU na azurfa (IHS) na tsawon mintuna 2 zuwa 3** har sai an gama man thermal paste ya yi laushi cikin man shafawa mai dumi.
3. Drip 99% Isopropyl Alcohol cikin Haɗin gwiwa: Aiwatar ** kashi 99 isopropyl barasa (IPA)** a kusa da dukkan gefuna huɗu inda murfin CPU na azurfa ya hadu da tushe mai sanyaya.
4. An Gani Ta Kabu Tare Da Falon Haƙori mara Kashe: Ja da 30-centimeter (12-inch) yanki na ** floss ɗin haƙori wanda ba a haɗa shi ba *** a cikin haɗin gwiwa tsakanin murfin CPU na azurfa da tushe mai zafi don karya hatimin injin.
5. ** Rike Gefen Gilashin Fiberglass Hudu da murguda Hankali:** Rike ** gefuna huɗu na tsaye na koren CPU substrate da murfin azurfa ** tare da babban yatsan yatsan hannu da fihirisa, kiyaye nesa daga fil ɗin gwal. Juyawa ** digiri 15 a kusa da agogon agogo da counter-clockwise , sannan zame CPU a kwance ** kashe gefen farantin jan karfe.

Mataki 3: Daidaita lankwasa AMD AM4 PGA fil tare da a 0.5 mm Pencil na Injini da Razor Blade¶

Rike keɓaɓɓen CPU a matakin ido kuma gani ƙasa kowace a tsaye (Y), a kwance (X), da jeri diagonal na fil 45-diagonal.

• Tsarin A - Ba komai 0.5 mm Hannun Hannun Fensir Na Injiniya (Filin Mutum): Saboda AMD AM4 pin da 0.32 millimeters (0.0126 inches) kauri, bakin karfe na fanko 0.5 mm (0.020-inchfensir inji (tsaftace da barasa) nunin faifai kai tsaye a kan filin lanƙwasa. Idan fil ɗin ya wuce digiri 45, dumi shi da na'urar bushewa.55 degrees Celsius / 131 degrees Fahrenheit) da kuma ɗaga shi zuwa digiri 45 tare da a #11 ruwan wukake ko tsinken hakori da farko, sannan a sanya hannun riga 0.5 mm titin fensir akan sandar kuma karkatar da shi tsaye.
• Tsarin B - Ruwan Razor Baki Guda ɗaya da Sharar Katin Kiredit (Layukan Karɓa): Zamewa mai tsafta ** reza mai baki ɗaya (0.10 mm ku 0.22 mm kauri)** ko siriri filastik katin (0.40 mm kauri) kasa 0.68-millimeter madogara tsakanin fitilun layuka a cikin dukkan kwatance huɗu (North-South, East-West, da duka diagonals), yana girgiza fuskar lebur a hankali a kan duk wani karkataccen fil don daidaita layin.

Mataki na 4: Gwajin Drop-Force na Zero-Force a cikin soket AM4 da ba a buɗe ba¶

1. Ɗaga hannun riƙe soket AM4 na uwa har zuwa ** Cikakken 90-digiri a tsaye a tsaye budewa ** da kuma fitar da duk wani manna mai zafi a cikin ramuka tare da mai tsabtace lambar lantarki ko 99 percent isopropyl alcohol.
2. Daidaita triangle na kusurwar zinari akan CPU tare da alwatika na soket kuma saki mai sarrafa a hankali: dole ne ya faɗi gaba ɗaya a cikin soket ɗin ƙarƙashin nauyinsa (Zero Insertion Force). Kada ka taɓa turawa AM4 CPU don tilasta shi ciki; idan kusurwa ɗaya ta zauna a sama, ɗaga ta waje kuma a sake daidaita madaidaicin fil ɗin a wannan kusurwar.

Sashe na 3: Daidaitaccen daidaitawar Intel LGA 1700 / 1851 da AMD AM5 motherboard soket fil¶

Gyara lankwasa cantilever spring fil a cikin Intel LGA 1700,Intel LGA 1851ko AMD AM5 Socket na uwa yana buƙatar haɓakawa da tallafin wuyan hannu saboda fil ɗin kawai 0.10 millimeters lokacin farin ciki.

Mataki 1: Gina ƙaramin tashar tiyatar benchtop¶

1. ** Ajiye Flat din Motherboard akan Tebur:** Cire duk igiyoyin wutar lantarki, sanya motherboard lebur akan akwatin kwalinsa, sannan buɗe ledar riƙewar CPU na ƙarfe da farantin kaya don isa ga digiri 360.
2. ** Saita Hannu-Kyauta 5x ku 10x Girmamawa:** Hana wayowin komai da ruwanka akan ƙaramin ɗan tafiya ko tarin litattafai da aka ajiye 8 to 12 centimeters (3 to 5 inches) kai tsaye sama da soket na CPU. Canja zuwa **Macro Lens ko 5x ku 10x Zuƙowa *** da kulle mayar da hankali kan fitattun socket.
3. ** Saita Tushen Haske mai Digiri 15 mai Motsi:** Kada a yi amfani da filasha da ke saman wayar (wanda ke haifar da kyalli). Sanya wani keɓan hasken walƙiya na LED a gefen motherboard yana haskaka saman saman soket a kusurwar kiwo mai ƙarancin digiri 15 zuwa 25**. Duk wani fil da aka lanƙwasa ta ko da 0.1 millimeters nan da nan ya tsaya a matsayin farar tartsatsi mai haske ko tazara mai duhu a kan grid ɗin uniform.

Mataki na 2: Zaɓi kayan aikin micro-bincike daidai kuma ku ɗaure hannayen hannu biyu¶

Kada a taɓa riƙe kayan aiki a tsakiyar iska sama da soket na LGA. Hannu marasa goyan baya suna rawar jiki 0.3 to 0.5 millimeters, wanda ya fi tazarar da ke tsakanin fil biyu na LGA.

1. ** Mafi kyawun Micro-Tools don Fin LGA:**
2. ** Bakararre 28-Gauge ku 30-Gauge Allurar sirinji na Insulin (0.30 mm ku 0.36 mm Diamita na waje) ko Fin ɗin ɗinki Mai Kyau:** Ƙaƙƙarfan ƙaƙƙarfan tip ɗin ya dace da tsabta a ƙarƙashin guda ɗaya. 0.4 mm-pitch LGA cantilever hannu ba tare da bumping makwabta.
3. ** Mai Lanƙwasa Micro-Tip Tweezers (ESD-15 ko Watchmaker Forceps) ko #11 Scalpel Blade:** Yana da kyau don kwance fitilun da aka ketare ko karkatar da filin da aka karkace a kaikaice a cikin layin sa.
4. ** Anchor Hannu Mai Hannu Biyu:** Ka kwantar da hannaye biyu a saman tebur sannan ka dasa yatsan zobe da ruwan hoda kai tsaye akan firam ɗin CPU na ƙarfe ko VRM heatsink ***. Jagoran titin allura tare da babban hannun ku yayin amfani da ƙusa mai ƙididdiga na ɗayan hannun ku don daidaita sandar allura. 1 centimeter sama da fil.

Mataki na 3: Takamaiman gyaran gyare-gyare don nau'ikan fil ɗin LGA guda 4 masu lanƙwasa¶

Juya hasken walƙiya na gefen ku a kusa da dukkan bangarori huɗu na soket bayan kowane ɗan ƙaramin daidaitawa:

• Al'amari na 1-Filin da aka karkatar da shi daga baya (Mai karkata hagu ko dama zuwa makwabci): Kada a tura kan madaidaicin tip a saman fil ɗin. Rage ma'anar ku 30G allura a cikin layin kusa da ** tsakiyar shaft (gwiwar hannu) na hannun cantilever **, kuma a hankali lanƙwasa sandar. 0.15 millimeters a gefe guda baya zuwa tsakiyar layinsa (da 0.05 mm cibiyar da ta gabata don asusu don elastic springback).
• Case 2 - Depressed or Crushed Pin (Sitting Too Low Below the Grid): Confirm which direction the surrounding cantilever arms point (the grain direction). Zamar da tip na ku 30G allurar sirinji ko budaddiyar hakora ** a karkashin hannun sama mai gangare na fitin da aka yanke, yana gabatowa daga budadden ƙugiya, kuma a hankali ya ɗaga sama da gaba tare da gangaren. 0.2 millimeters har sai da kansa na zinariya yana nuna hasken gefen daidai tsayi daidai da makwabta.
• Al'amari na 3 - Fil mai ɗagawa ko Ƙungiya (An ja sama da Fiber Cloth ko Yatsa): Kada a taɓa turawa ƙasa a tsaye a kan tip. Sanya fuskar allurar ta lebur a bayan babban lanƙwan fil ɗin kuma bugun jini a hankali ** gaba da ƙasa a kusurwar digiri 45 tare da gangaren dabi'ar cantilever *** don haka hannun bazara yana ninkewa sannu a hankali zuwa tsayi iri ɗaya.
• ** Hali na 4 - Fil ɗin da aka ninke Digiri 180 Baya ko Ketare Ƙarƙashin Maƙwabci:** Idan an makale a ƙarƙashin maƙwabci mai lafiya, yi amfani da allura ta biyu don riƙe fil ɗin lafiyayye. 0.1 mm a gefe kawai isa don zame tip ɗin da aka kama. Sa'an nan kuma zame allurar ku a ƙarƙashin madauki mai naɗewa kuma ku ɗaga hannu a hankali a cikin ** matakai biyu na 45 . Idan fil ɗin ya karye gaba ɗaya yayin buɗewa, cire guntun ƙarfe maras kyau tare da tweezers kuma ci gaba zuwa ** Sashe na 4 (Audit Pinmap Socket) a ƙasa.

Sashe na 4: Socket Pinmap Audit (menene zai faru idan fil 1 ko 2 sun kama gaba ɗaya?)¶

Na'urorin sarrafa tebur na zamani sun ƙunshi tsakanin 1,331 kuma 1,851 fil, duk da haka sama da kashi 35 na waɗancan fil ɗin ba su da yawa.VSS) ya dawo, daidaici Power (VCC) fil, ko Ajiye marasa amfani (RSVD) pad.

1. Tabbatar Karyewar Taswirar Wutar Lantarki: Karkashin 10x smartphone macro zoom, tabbatar da cewa ragowar karfen da ke kasan socket pinhole na roba yana zaune a tsaftace a cikin rijiyarsa kuma ** baya taba wani fil dake kusa da shi**.
2. Kidaya Layukan (Wasika) da Rukunin (Lambar) Haɗin kai: Kidaya a hankali daga kusurwar maɓalli (alama ta alwatika akan firam ɗin soket) ta amfani da hoton macro don tantance ainihin daidaitawar fil ɗin da ya ɓace (misali, Row AM, Column 24).
3. Cross-Reference the official Socket Pinmap: Duba Intel Core Processor Datasheet Volume 1 (Ballout and Pinout) PDF don LGA 1700 / 1851 ko buɗaɗɗen mabuɗin bayanan pinmap na AMD Socket AM5 (LGA 1718) kuma Socket AM4 (PGA 1331):

Sashe na 5: Tabbatar da gyara bayan gyara da amintacciyar yarjejeniya ta takalmin farko¶

1. ** Yi 4-Angle Macro Photo Check (LGA Sockets):** Ɗauki manyan hotuna daga Arewa, Kudu, Gabas, da Yamma ɓangarorin ƙarƙashin haske na gefe 15 don tabbatar da kowane tsinken zinari yana zaune a layi a tsayi iri ɗaya tare da guntun ƙarfe mara nauyi.
2. ** Yi 1-Stick RAM + Boot Gwajin Heatsink:** Sanya sandar RAM guda ɗaya a ciki. DIMM A2, Ka huta mai sanyaya CPU ɗinka a saman na'ura mai sarrafawa tare da dab da manna thermal, toshe ciki CPU_FAN, da kunna wuta yayin kallon madaidaicin LEDs EZ Debug LEDs (CPU -> DRAM -> VGA -> BOOT). Da zarar ya shiga UEFI/BIOS da tsafta, rufe, shigar da sauran sandunan RAM ɗinku a cikin tashoshi biyu (A2 + B2), hawa na'urar sanyaya cikakke, kuma tabbatar da ciki CPU-Z kuma GPU-Z cewa duk RAM tashoshi da PCIe x16 hanyoyi suna aiki.

Lambobin gaggawa na yanki da ka'idojin hukumar¶

Duk da yake lanƙwasa CPU da fitilun soket sune farkon gaggawar dawo da kayan aiki, gajeriyar da'ira mai ƙarfi ta hanyar manyan hanyoyin isar da wutar lantarki mai ƙarfi (amperage).150A to 250A) na iya narke soket ɗin thermoplastics, kunna fiberglass resins PCB, ko haifar da fashewar capacitor:

• Amurka da Kanada: Kira 911 nan take idan motherboard ko guntun wutar lantarki ya haifar da buɗe wuta ko hayaƙi mai nauyi bayan cire haɗin wutar bangon AC. Bayar da rahoton abubuwan haɗin kwamfuta mai kunna kai mai haɗari ga *U.S. Hukumar Kare Kayayyakin Mabukaci (CPSC) a SaferProducts.gov ko ** Tsaron Samfuran Masu Amfani da Lafiyar Kanada ***.
• United Kingdom: Kira 999 (ko 112) don gaggawar wutar lantarki. Ƙarƙashin Dokar Haƙƙin Abokan Cin Hanci na Burtaniya 2015**, idan sabuwar uwar uwa ta zo daga dillali mai lankwasa fitilun LGA a ƙarƙashin murfin filastik na masana'anta (Dead on Arrival / Transit Damage), Tsaya kafin a taɓa fil ɗin tare da kowane kayan aiki, ɗauki hoton soket ɗin da ba a buɗe/buɗe ba nan da nan, kuma a nemi maye gurbin dillali a cikin kwanaki 30.
• Tarayyar Tarayyar Turai: Kiran kira 112 don amsa gobarar gaggawa ko jinya a duk ƙasashe membobin EU. Karkashin Jagorancin ** EU (EU) 2019/771**, duk wani rashin daidaituwa (kamar ma'aikata-lanƙwasa socket fil ɗin da ake bayarwa yayin bayarwa) an ruwaito jim kaɗan bayan buɗe akwatin ana tsammanin ya wanzu a lokacin bayarwa sai dai idan mai siyarwa ya tabbatar da in ba haka ba.
• ** Ostiraliya da New Zealand:** Kira 000 a Ostiraliya ko 111 a New Zealand don abubuwan gaggawar gobara. Ana aiwatar da garantin kayan masarufi na doka ta Hukumar Gasar Australiya da Hukumar Kula da Abokan Ciniki (ACCC) da ** Kariyar Abokin Ciniki New Zealand*.
• Indiya da Asiya-Pacific:* Dial 112 a Indiya,119* a Japan da Koriya ta Kudu, ko 995 a Singapore. Don cikakken jerin abubuwan duniya, duba lambobin gaggawa.

Tambayoyin da ake yawan yi¶

Shin ASUS, MSI, Gigabyte, ko ASRock za su maye gurbin motherboard a ƙarƙashin garanti na kyauta idan na lanƙwasa ginshiƙan soket na CPU da gangan yayin shigarwa?¶

Tabbataccen garantin masana'anta na masana'anta suna rarraba fitilun soket LGA masu lanƙwasa azaman Lalacewar Abokin Ciniki (CID) kuma keɓe su daga kewayon garanti kyauta sai dai idan kuna iya rubutawa tare da buɗe hotuna ko bidiyo cewa an riga an lanƙwasa fil ɗin ƙarƙashin murfin filastik lokacin da aka buɗe akwatin da aka hatimi. Koyaya, ASUS, MSI, Gigabyte, da ASRock duk suna ba da garanti na CPU Socket Replacement Services (yawanci farashi tsakanin $ 50 da $ 120 USD dangane da yanki da nau'in soket), inda masu fasahar masana'anta ke lalata soket ɗin LGA na filastik da aka lalace akan tashar sake aikin BGA mai infrared tare da siyar da sabon jirgi mai ƙima don siyan sabbin farashin masana'anta akan sabon katako na katako.

Me yasa PC dina yayi kyau bayan na gyara madaidaitan faifan soket na LGA, amma yanzu biyu daga cikin ramummuka na RAM guda hudu (Channel A ko Channel B) basa aiki kuma suna haifar da hasken DRAM mai rawaya?¶

Kusan kashi ɗaya cikin biyar na fil ɗin da ke cikin Intel LGA 1700/1851 ko AMD AM5 soket waya kai tsaye daga Integrated Memory Controller na processor (IMC) zuwa alamun jan karfe da ke ciyar da ramukan DDR4 ko DDR5 RAM. Idan ɗayan fil ɗin da kuka daidaita yana daidaita hagu-zuwa-dama daga sama amma yana zaune 0.2 millimita yayi ƙasa sosai a tsaye, ya kasa yin tabbataccen tuntuɓar bazara tare da kushin zinare a ƙasan CPU, yana kashe ko dai Memory Channel A (ramuka A1/A2) ko Tashar ƙwaƙwalwar ajiya B (ramuka B1/B2). Cire CPU, bincika fil ɗin da aka gyara a ƙarƙashin haske na gefe 15, kuma yi amfani da allurar 30G don ɗaga titin fil ɗin mai rauni a hankali sama da 0.2 millimeters don haka yana danna da ƙarfi akan kushin CPU.

Menene ya kamata in yi idan ƙaƙƙarfan fil ɗin zinare ya zame gaba ɗaya daga ƙasan na'urar sarrafa AMD AM4 Ryzen na?¶

Da farko, kar a jefar da gwal ɗin da ya karye; sanya shi a cikin wata karamar jakar da aka rufe. Bincika taswirar pinout na hukuma AMD Socket AM4 don ainihin wurin da ya ɓace: idan VSS (Ground) ne ko RSVD (Ajiye) fil, mai sarrafawa zai yi aiki a kwanciyar hankali 100 ba tare da shi ba. Idan fil ɗin da ya ɓace shine tashar ƙwaƙwalwar ajiya da ake buƙata, PCIe, ko fil ɗin taya, kowane gogaggen kantin sayar da kayan lantarki (ko agogon / ƙwararren laser-welding technician) na iya siyar da asalin karyar fil ɗin ku ko fil ɗin mai ba da gudummawa daga matattu $ 10 AM4 Athlon processor baya kan kushin tagulla na tagulla a kasan Ryzen CPU ɗin ku a cikin kusan mintuna 15.

Zan iya sauke fil ɗin zinare da aka karye a cikin ramin da ya dace a cikin soket ɗin motherboard na AMD AM4 kuma in saita CPU a samansa azaman gyara na wucin gadi?¶

Yayin sanya tsaftataccen fil ɗin PGA madaidaiciya madaidaiciya a cikin daidai madaidaicin pinhole na soket na AMD AM4 wani lokaci yana ba da damar nauyi da soket ɗin cam ɗin don danna saman madaidaicin fil ɗin akan kushin mai sarrafa don haka zaku iya taya sau ɗaya kuma adana fayilolin gaggawa, ba abin dogaro bane don amfani na dogon lokaci. Zagayen zagayawa na thermal da rawar jiki suna sa fil ɗin da ba a saida ba ya rasa tuntuɓar lokaci-lokaci ko kuma zurfafa zurfafa a cikin gidajen soket, yana haifar da faɗuwar tsarin kwatsam kuma yana sa fil ɗin ya yi wahala a dawo da shi ba tare da tarwatsa saman murfin soket ɗin filastik ba.

Ta yaya zan san lokacin da murfin soket ɗin CPU na filastik yakamata ya fito yayin shigarwar Intel ko AMD AM5?¶

Kada ku taɓa murfin kariya na filastik baƙar fata daga soket na Intel LGA ko AMD AM5 tare da yatsunku kafin shigar da na'ura mai sarrafawa, saboda hakan yana barin fil ɗin da ba a bayyana ba ga skru da yatsunsu da aka sauke kuma yana sauƙaƙa dunƙule fil yayin da kuke zaune CPU. Madadin haka, bar murfin filastik a kan firam ɗin riƙe da ƙarfe, buɗe firam ɗin, sanya processor a hankali a kan soket ɗin da ke daidai da kusurwar kusurwar zinari da notches na gefe, sannan rufe firam ɗin ƙarfe kuma ku matse ledar riƙewa ƙasa: murfin kariya na filastik yana yin aikin injiniya don tashi ta atomatik yayin da firam ɗin ƙarfe ya danna ƙasa a gefuna na CPU.

Shin ƙirar ƙirar LGA 1700 na Intel LGA (maƙarƙashiyar rigakafin lankwasawa) tana haifar da lankwasa socket fil yayin shigarwa?¶

Firam ɗin tuntuɓar masana'anta na aluminum CPU (kamar Thermalright ko Thermal Grizzly Contact Frame) ba zai lanƙwasa fil ɗin soket ba idan an shigar da shi sosai akan tebur mai kwance a kwance, saboda yana kewaye da kewayen wajen na'urar ba tare da taɓa layin fil ba. Koyaya, fitilun lanƙwasa suna faruwa akai-akai lokacin da magina suka buɗe skru huɗu na Torx T20 na masana'anta Intel ILM bracket yayin da uwa ke tsaye a tsaye a cikin akwati na PC, yana haifar da shingen ƙarfe mara nauyi ko babban bangon bangon hexagonal a bayan motherboard don zamewa da faɗuwa kai tsaye cikin fitilun soket da aka fallasa. Koyaushe shigar da firam ɗin lamba tare da motherboard yana kwance akan tebur kuma tare da CPU riga ya zauna a cikin soket don kare fil.

Jagora masu alaƙa¶

• CPU soket thermal manna zube da makale heatsink
• Ruwan ƙarfe na zafin jiki gallium yana zubewa akan kayan uwa na uwa ko GPU
• M.2 NVMe SSD ya ɓace PCB mai lankwasa, tsiri dunƙule, da makale heatsink ceto
• Haɗin kebul na samar da wutar lantarki na zamani, soyayyen SATA SSD tafiyarwa, da ceton rashin dacewa
• Kwamfuta mai zafi fiye da kima da mai sanyaya ruwa yana zubar da gaggawa

Tushen da jagorar hukuma¶

• ** Kamfanin Intel:** Intel Core Processor Family Datasheet, Volume 1 & LGA1700 / LGA1851 Socket Mechanical Design Guide (Jagorar Taimakawa) (Iyakar madaidaicin lokacin bazara, ƙayyadaddun ƙayyadaddun ƙarfi na ILM, da ayyukan filaye na hukuma).
• ** Na'urori Masu Ƙarfi (AMD): *** * AMD Socket AM5 (LGA 1718) da Socket AM4 (PGA 1331) Shigarwa Mai sarrafawa da Ka'idodin Cire Heatsink* (Tsarin dumamar yanayi na tilas da ka'idojin kawar da jujjuyawa don masu sarrafa PGA).
• ** IPC (Association Connecting Electronics Industries):** * IPC-A-610 Yarda da Tattaunawar Lantarki * da * IPC-7711/7721 Sake Aiki, Gyarawa da Gyaran Taro na Lantarki * (Maganin-masana'antu na haɗin gwiwar haɗin gwiwar haɗin gwiwar haɗin gwiwa da sarrafa ayyukan ESD).
• ** EIA / ECA (Ƙungiyar Abubuwan Kayan Wutar Lantarki):** * Hanyar Gwajin Muhalli na EIA-364-1000 don Masu Haɗin Lantarki da Sockets* (Iyakokin gajiyawar bazara na Copper-beryllium da tuntuɓar buƙatun ƙarfin al'ada).