Hoʻopaʻa ʻia nā PPU LGA Pins ma Intel a i ʻole AMD AM5 Motherboard, a i ʻole AM4 CPU i ʻoki ʻia i ka Heatsink: Razor Blade a me Dental Pick Realignment¶

He mau manawa liʻiliʻi i ka hana ʻana o kahi kamepiula pilikino maʻamau a i ʻole ka hoʻomaikaʻi ʻana i ka thermal paste i mea e hopohopo koke ai ma mua o ka hāpai ʻana i ka uhi pale pale plastik a i ʻole ka wehe ʻana i kahi mea hoʻomaʻamaʻa CPU a ʻike i kahi puʻupuʻu ʻālohilohi o nā pine gula i kulou i loko o kahi Intel. LGA 1700, Intel LGA 1851, a i ʻole AMD AM5 motherboard, a i ʻole ka ʻike ʻana i kāu AMD AM4 Ua ʻoki pololei ʻia ke kaʻina hana Pin Grid Array (PGA) mai kāna kīʻaha Zero Insertion Force (ZIF) i hoʻopaʻa ʻia i ka wā i hoʻopaʻa ʻia i lalo o ka heatsink alumini. E hoʻohana ana i ka motherboard i ka wā e pā ana nā pine puna cantilever ʻelua e pili ana i Land Grid Array (LGA) VCC hoʻokomo ʻia ka pine mana i loko o ka lepo VSS a i ʻole hiki i ka papa hoʻomanaʻo hoʻomanaʻo ke hoʻouna i ke au i hoʻoponopono ʻole ʻia ma o ka substrate kaʻina hana, e hoʻopau mau i kahi papa hoʻopili ma ka motherboard a me ka CPU i loko o nā milliseconds. Inā hoʻopuka ʻia ka ʻāʻī pōkole CPU i hoʻoikaika ʻia, ka uahi ʻepoxy ʻā, a i ʻole ke ahi uila i loko o kāu pahu kamepiula, e hoʻopau i ke kua o ka mana hope, e wehe koke i ke kaula o ka paia o ke au. helu pilikia. No nā pilikia ulia pōpilikia kamepiula pili pili, e ʻike i kā mākou alakaʻi ma Hoʻoheheʻe ʻia ke kumu hoʻoheheʻe wela a me ka wehe ʻana i ka heatsink paʻa, kahe ka wai metala thermal compound gallium ma nā ʻāpana motherboard, a M.2 NVMe SSD e nalo ana i ka PCB kuʻi kūlou a paʻa i ka hoʻopakele heatsink.

ʻOiai ke ʻano o ka pōʻino o kahi ʻāpana ʻino o nā kumu kumu microscopic a i ʻole ka lālani skewed o nā pine processor AMD Ryzen e nānā i ka maka ʻōlohelohe, ʻo ka copper-beryllium (CuBe) a me nā ʻāpana phosphor-bronze i hoʻohana ʻia i nā hui CPU hou i hana ʻia no ka deflection spring elastic a loaʻa i ka ductility kiʻekiʻe ma mua o ka hiki ʻana o ka haʻihaʻi paʻakikī. ʻOiai ʻaʻole ʻoe e laka i kahi kaʻina hana i lalo ma luna o nā pine LGA i kulou e hoʻāʻo inā he kāmaʻa, mai ʻoki ʻoe i kahi mea hana AM4 i hoʻopaʻa ʻia mai kahi heatsink anu me kahi screwdriver flathead, a hoʻohana i ke kukui raking direction, 5x i 10x ka hoʻonui ʻana i ka macro smartphone, a me nā mea hana alignment micro-mechanical e like me ka hakahaka 0.5 mm (0.020-inch) ka piko penikala mechanical, a sterile 28G i 30G ka nila syringe insulin, a i ʻole a 0.10 mm (0.004-inch) hoʻokahi ʻaoʻao carbon steel pahi pahi, hiki iā ʻoe ke hoʻihoʻi i nā kumu motherboard Land Grid Array a me nā mea hana Pin Grid Array i ka hoʻomau uila o ka hale hana.

E hana i kēia i kēia manawa¶

1. Mai hoʻopaʻa i ka CPU i lalo i loko o kahi kumu me nā pine LGA i piʻo a i ʻole e hoʻā i ka lako mana. Hoʻopili ʻia ka laka paʻa 350 to 490 Newtons (80 to 110 pounds-force) o ka ikaika kū pololei ma luna o ka poʻi hana. Ina he piko LGA 1700, LGA 1851, a i ʻole AM5 ʻOpiʻi ʻia ka pine puna ma waho o ke kūlana, ʻo ka hoʻopaʻa ʻana i ka CPU e haki i ka piko gula palahalaha a hiki ke pōkole a 1.3V VDDCR a i ʻole VCCIA ke alahao mana kumu i loko o a 0.8V pahu hōʻailona ma kāu mea hana.
2. Mai holoi a palaki i kahi kumu motherboard Intel LGA a i ʻole AMD AM5 i hōʻike ʻia me ka lole, ke kāwele pepa, a i ʻole ka pulupulu pulupulu. Ua hana ʻia kēlā me kēia pine i loko o kahi kumu LGA e like me ka makau iʻa microscopic i kihi ʻia ma 30 a 45 degere. ʻO ke kauo ʻana i hoʻokahi pulupulu pulupulu ma waena o ka laha e hoʻopaʻa ʻia i nā haneli o nā ʻōlelo aʻoaʻo puna maikaʻi a huki iā lākou i hope.
3. **Inā huki ʻia kāu kaʻina hana AMD AM4 mai loko mai o ke kumu motherboard i paʻa i paʻa i ka lalo o ka mea hoʻoluʻu CPU, e hoʻonoho i ka mea hoʻoluʻu i lalo (ʻo nā pine CPU e kū pono ana i ke kaupaku) ma kahi pākaukau paʻa koke.
4. E noʻonoʻo i ke kumu pohō a i ʻole ka mea hana mai nā kihi panana ʻehā me ka hoʻohana ʻana i kahi kukui kukui LED i paʻa ma kahi kihi 15-degere raking i ka nānā ʻana ma o kahi. 5x i 10x ʻO ka pahupaʻikiʻi macro smartphone ma kahi tripod. ʻO ke kukui ʻaoʻao pāpaʻu e ʻālohilohi a i ʻole e hoʻolei ʻia kahi āpau ʻeleʻele i ka mānoanoa like ʻole.
5. ** E kiʻi i kahi kiʻi macro kiʻekiʻe o nā pine i kulou a nānā i ka Intel mana LGA 1700 / 1851 aiʻole AMD AM5 kiʻi pinmap kumu ma mua o ka pā ʻana i kekahi pine.** Ma luna o 30 pakeneka o ka 1,700 to 1,851 ʻO nā pine i loko o kahi kumu CPU hou he ʻano ʻē aʻe ka Ground (VSS) nā pine a i mālama ʻia (RSVD) nā pā. Inā ʻoki maʻemaʻe kahi pine hoʻokahi a ʻaʻole hoʻopā i nā hoalauna, ʻo ka nānā ʻana i ka pinmap e haʻi iā ʻoe inā e holo maʻamau ka papa me ka ʻole o ke kino.
6. E hoʻoneʻe i nā pine LGA a i ʻole PGA i hoʻonui ʻia (0.1 mm i 0.2 mm) ma ka ʻaoʻao ʻē aʻe o ka piko. Ua pilikia ka metala puna keleawe-beryllium i ka paʻakikī o ka hana inā piʻo pinepine i hope. Hoʻokahi nudge i hoʻopaʻa ʻia i loko o ka alignment grid e mālama i ka ikaika o ka pine, ʻoiai ʻo ka wiliwili ʻana i kahi pine ʻekolu manawa e hemo ai.

Laau hoʻoholo: Ke hoʻāʻo nei iā Intel LGA 1700/1851, AMD AM5, a paʻa i nā pilikia pilikia AMD AM4.¶

flowchart TD
    A["Puku CPU a i ʻole ka mea hana Pin Emergency"] --> B{"ʻO wai ka CPU a me ka Socket Architecture?"}
    B -->|"Intel LGA 1700 / 1851 a i ʻole AMD AM5 (Pins i ka Papa makuahine)"| C{"Ke kūlana o nā pine LGA i kulou ma lalo o 10x macro?"}
    C -->|"1 a 8 mau pine i wili a noho haʻahaʻa/kiʻekiʻe"| D["E kau i ke kelepona ma ka tripod ma 10x zoom me ke kukui 15-degere -> E hoʻohana i ka nila 30G ma lalo o ka pine kuʻekuʻe -> Nudge i loko o ka pā"]
    C -->|"Hoʻopili ʻia ka ʻaoʻao o ka pine ma 180 degere a i ʻole i hoʻopaʻa ʻia"| E["E hoʻoheheʻe i ka nila 30G ma lalo o ka puka lou -> E hoʻokiʻekiʻe i 0.3 mm e hoʻomaʻemaʻe i ka hoalauna -> E alakaʻi i ka cantilever i mua ma ka palaoa."]
    C -->|"Hoʻopau maʻemaʻe ka pine 1 ma ke kumu"| F["E hoʻokaʻawale i ka stub -> E nānā i ka hoʻonohonoho X/Y ma ka palapala ʻāina Pinout -> Inā ʻo VSS a i ʻole RSVD, e hoʻopaʻa palekana; inā pilikia, e hoʻololi i ke kumu"]
    C -->|"15+ pine i ʻoki ʻia e ka mea hana i hāʻule"| G["Hoʻopau i ka DIY -> E hoʻohana i ka ASUS / MSI / Gigabyte / ASRock Socket Replacement Service ($ 50 a i $ 120)"]
    B -->|"AMD AM4 PGA (Pina ma lalo o ka CPU)"| H{"Ua paʻa anei ka CPU AM4 i ka Heatsink?"}
    H -->|"ʻAe: Ua ʻoki ʻia i ka mea hoʻomaʻamaʻa"| I["E hoʻohuli i ka mea hoʻomaʻamaʻa -> E hoʻomaʻamaʻa i ka heatsink i 65 C no 3 min -> Hoʻoheheʻe 99% IPA -> ʻIli me ka floss niho -> Hoʻololi i nā kihi CPU 15 deg."]
    H -->|"ʻAʻole: Hoʻokaʻawale ʻia, piʻi nā pine āpau"| J{"Pehea ka ino o na pine PGA paa?"}
    J -->|"Huli ʻia 10 a 45 degere"| K["E hoʻolei i ka pahi pahi kahi ʻaoʻao hoʻokahi a i ʻole kāleka hōʻaiʻē ma nā kahawai X/Y -> E hoʻohana i ka ʻaoʻao penikala 0.5 mm ʻole."]
    J -->|"Hoʻopili ʻia 80 a 90 degere"| L["Ke kumu pine mahana (55 C) -> E hoʻokiʻekiʻe i ke 45 deg me ka pahi #11 -> E hoʻopau pololei me ka penikala mechanical 0.5 mm."]

Māhele 1: Hoʻomaopopo i ka LGA cantilever spring mechanics vs. PGA solid pines¶

1. Land Grid Array (LGA) nā kumu: Intel LGA 1700, LGA 1851, LGA 1200, a me AMD AM5 (LGA 1718)¶

I kēia manawa Intel a me AMD Ryzen 7000/8000/9000 (Socket AM5) motherboards, aia ka mea hana i nā pad pili gula palahalaha ma ka lalo, aʻo ka 1,700 a 1,851 nā pine puna e noho ana i loko o ke kumu motherboard:

+---------------------------------------------------------+
|  INTEL LGA 1700/1851 OR AMD AM5 CANTILEVER SOCKET PIN   |
|          CPU Gold Contact Land (Presses Down)           |
|                 =======================                 |
|                          *  <-- 0.15 mm Contact Tip     |
|                        /   <-- Upper Arm (Angled 35 deg)|
|     Spring Elbow -->  (                                 |
|                         \  <-- Lower Base Beam          |
|  ========================|========================      |
|  LGA Plastic Socket Floor (0.4 mm to 0.8 mm Pitch)      |
+---------------------------------------------------------+

• Microscopic Dimensions: Ua hoʻopaʻa ʻia kēlā me kēia LGA pine mai ke keleawe-beryllium i uhi ʻia i ke gula (CuBe) a i ʻole phosphor-bronze e ana ana 0.08 millimeters a 0.12 millimeters (0.003 a 0.005 inches) mānoanoa, i hoʻokaʻawale ʻia ma kahi 0.4 mm x 0.8 mm pitch.
• ** Kūʻē Quadrant Grain:** Ua ʻike ʻia kahi punawai Intel a i ʻole AMD AM5 maikaʻi e māhele ʻia i ʻelua hapa a i ʻole ʻehā quadrants e hōʻike ʻokoʻa ana i ka mālamalama no ka mea e hoʻoheheʻe ʻia ka cantilever kihi ma nā ʻaoʻao ʻē aʻe i nā ʻaoʻao e kaulike ai i nā ikaika wela.
• No ke aha ke kiki pololei ana i lalo e hoʻopōʻino i kahi pine LGA: Hoʻopiʻi ʻia kahi pine LGA ma ke kiʻekiʻe 0.25 millimeters ke kaomi iho o ka papa CPU palahalaha. ʻO ka hoʻokuʻu ʻana i kahi pine i piʻo pololei i lalo e hāʻule ai kona kuʻekuʻe puna ma lalo o nā pine a puni, e hana ai i kaapuni hāmama.

2. Huʻi Māhele Pin (PGA) nā mea hana: AMD Socket AM4 (Ryzen 1000/2000/3000/5000)¶

• Nā Poʻomanaʻo Kūlohelohe Paʻa ma ka CPU: ʻO ka 1,331 mau pine keleawe i uhi ʻia i ke gula i hoʻopaʻa ʻia i ke gula i hoʻopaʻa ʻia i lalo o ka substrate processor fiberglass ʻōmaʻomaʻo i kahi. 1.00 millimeter (0.039-inch) ʻāʻī (X/Y) grid, kēlā me kēia ana 0.32 millimeters (0.0126 inches) mānoanoa a 3.0 millimeters (0.12 inches) lōʻihi.
• No ke aha e ʻoki ʻia ai nā CPU AM4 mai nā kumu i hoʻopaʻa ʻia: ʻAʻole like me nā kumu LGA (e hoʻopaʻa i nā pepeiao o ka mea hana ma lalo o ke kiʻi kila), ka AMD AM4 ʻAʻohe ʻaoʻao kiʻekiʻe o ke kumu ZIF e paʻa ana i nā ʻaoʻao CPU i lalo. I ka wā e ho'ōla ai ka paila wela ma luna o 2 a 4 mau makahiki i loko o ka sima maloʻo ma waena o nā 38 mm x 38 mm ʻO ka poʻi CPU a me ke kumu ʻoluʻolu, ʻo ka huki ʻana i luna ma luna o ka mea hoʻoluʻu e lanakila ai i ka hoʻoheheʻe ʻana i ke kumu kumu o loko, e ʻoki pololei ana i ka mea hana mai ke kumu pani.

Mahele 2: Hoʻopakele i kēlā me kēia ʻanuʻu no kahi CPU AMD AM4 i ʻoki ʻia i ka heatsink¶

KaʻAnuʻu Hana 1: Hoʻopaʻa i ka mea hoʻoluʻu hoʻohuli a nānā i nā pine perimeter¶

1. E hoʻohuli i ka mea ʻoluʻolu CPU i luna i lalo no laila e kuhikuhi pololei nā ** pine gula o ke kaʻina hana AM4 paʻa i luna**, a hoʻopaʻa i ka heatsink i loko o kahi pahu a i ʻole ke kāwele i ʻōwili ʻia ma ka papaʻaina.
2. **Mai hoʻokuʻu hou i ka CPU paʻa a me ka hui ʻoluʻolu i loko o ke kumu motherboard i pani ʻia.
3. E kali a hiki i ka **ma hope o ka wehe ʻana i ke kaʻina hana mai ka heatsink ma mua o ka hoʻopololei ʻana i nā pine a puni, i hiki i kou manamana lima ke paʻa pono i nā ʻaoʻao fiberglass ʻōmaʻomaʻo i ka wā e wehe ʻia ai.

KaʻAnuʻu 2: ʻO ke ʻano "65-Degree Hairdryer + Isopropyl Alcohol + Dental Floss Twist"¶

Mai ʻohi ma waena o ka pāpaʻi CPU fiberglass ʻōmaʻomaʻo a me ke kumu heatsink metala me ka screwdriver a i ʻole ka pahi.

1. Hoʻopuni i ka Heatsink me nā kāwele palupalu: E hoʻopili i ka pākaukau a puni ka mea hoʻoluʻu i pae mālie ka CPU inā e hoʻokuʻu koke ka paʻi.
2. Hoʻomaʻamaʻa i ka Heatsink Base a me ka Poʻi CPU i 60 a 70 Degere Celsius (140 a 158 Degere Fahrenheit): Hoʻomoe i kahi mea hoʻomaloʻo lauoho ma High Heat 5 centimeters (2 inches) mai ke kumu keleawe keleawe a me ka uhi kālā CPU (IHS) no 2 a 3 mau minuke a hiki i ka wā e palupalu ai ka paila wela i loko o ka ʻaila mehana.
3. E hoʻokuʻu i ka waiʻona isopropyl 99 pakeneka i loko o ka hui: E hoʻopili 99 pākēneka isopropyl alcohol (IPA) a puni nā ʻaoʻao ʻehā kahi e hui ai ka poʻi CPU kālā me ke kumu maloʻo.
4. Ua ʻike ʻia ma o ka humu hoʻopili ʻana me ke kāʻei niho ʻole: Huki a 30-centimeter (12-inch) ʻāpana o ka flos niho i wili ʻole ʻia i loko o ka hui paʻi ma waena o ke poʻi CPU kālā a me ke kumu heatsink e wāwahi ai i ke sila ʻā.
5. Paʻa i nā kihi ʻehā ʻōmaʻomaʻo Fiberglass a me Twist Horizontally: Hoʻopaʻa i ka ** ʻehā ʻaoʻao kūpaʻa o ka substrate CPU ʻōmaʻomaʻo a me ka poʻi kālā** me kou manamana nui a me kou mau manamana lima kuhikuhi, e mālama pono i nā pine gula. E wili i 15 degere ma ka ʻaoʻao a me ka ʻaoʻao ʻaoʻao, a laila e hoʻoheheʻe i ka CPU ma ke alo ** mai ka ʻaoʻao ʻaoʻao o ka pā keleawe**.

KaʻAnuʻu 3: Hoʻopololei i nā pine AMD AM4 PGA me kahi 0.5 mm Pencil Mechanical a me ka pahi pahi¶

E hoʻopaʻa i ka CPU i hoʻokaʻawale ʻia ma ka ʻili o ka maka a ʻike i lalo i kēlā me kēia kū pololei (Y), paewaewa (X), a me ka lālani diagonal 45-degere o nā pine.

• ** ʻenehana A - Haʻahaʻa 0.5 mm ʻO ka lima penikala mīkini (paʻi hoʻokahi):** No ka mea he AMD AM4 ʻo ka pine 0.32 millimeters (0.0126 inches) mānoanoa, ka piko metala o kahi 0.5 mm (0.020-inch) penikala mīkini (hoʻomaʻemaʻe ʻia me ka waiʻona) paheʻe pololei ma luna o kahi pine piʻo. Inā palahalaha ka pine ma mua o 45 degere, hoʻomaʻamaʻa iā ia me kahi mea maloʻo lauoho (55 degrees Celsius / 131 degrees Fahrenheit) a hoʻokiʻekiʻe iā 45 degere me ka a #11 ka lau a i ʻole ka niho niho mua, a laila lima i ka 0.5 mm ʻoi aku ka penikala ma luna o ke kumu a hoʻopololei pololei.
• Kūkini B - Hoʻokahi ʻEdge Razor Blade a me Kāleka ʻAiʻē Sweep (Nā Lālani Kēkē): E hoʻoneʻe i kahi maʻemaʻe ka pahi pahi maʻemaʻe hoʻokahi (0.10 mm i 0.22 mm mānoanoa) a i ʻole ka pepa pepa ʻiʻo lahilahi (0.40 mm mānoanoa) iho i ka 0.68-millimeter nā alahele ma waena o nā lālani pine ma nā ʻaoʻao ʻehā (North-South, East-West, a me nā diagonal ʻelua), e hoʻoluliluli mālie i ke alo o ka maka i kekahi pine kekee e hoʻolike ai i ka lālani.

KaʻAnuʻu Hana 4: ʻO ka "Zero-Force Drop Test" i loko o ka puka AM4 i wehe ʻia¶

1. E hoʻokiʻekiʻe i ka lima paʻa paʻa ʻana o ka motherboard AM4 a hiki i kona ** kūlana hāmama kū pololei he 90-degere ** a hoʻokuʻu aku i nā mea hoʻoheheʻe wela i loko o nā puka pine me ka hoʻomaʻemaʻe kelepona uila a i ʻole. 99 percent isopropyl alcohol.
2. E hoʻohālikelike i ka triangle kihi gula ma ka CPU me ka triangle socket a hoʻokuʻu mālie i ke kaʻina hana: pono e hāʻule i lalo i ke kumu ma lalo o kona kaumaha ponoʻī (Zero Insertion Force). **Mai hoʻokuʻu i lalo i kahi CPU AM4 e hoʻoikaika iā ia i **; inā e noho kiʻekiʻe kekahi kihi, e hāpai a hoʻopololei hou i ke pine kekee ma kēlā kihi.

Mahele 3: Hoʻoponopono pololei i ka Intel i piko LGA 1700 / 1851 a me AMD AM5 nā mākia kumu motherboard¶

Hoʻoponopono i nā pine puna cantilever i loko o kahi Intel LGA 1700, Intel LGA 1851, a i ʻole AMD AM5 Pono ke kumu motherboard i ka hoʻonui a me ke kākoʻo lima no ka mea ʻo nā pine wale nō 0.10 millimeters mānoanoa.

KaʻAnuʻu Hana 1: E kūkulu i kāu keena micro-surgery benchtop¶

1. E hoʻomoe i ka Papa Motherboard ma luna o ka pākaukau: Wehe i nā uwea mana a pau, e kau i ka motherboard ma luna o kona pahu pahu pahu, a wehe i ka lever hoʻopaʻa CPU kila a me ka pā hoʻouka ʻana no ke komo 360-degere.
2. Hoʻonohonoho lima ʻole 5x i 10x Hoʻonui: E kau i ke kelepona ma luna o kahi tripod liʻiliʻi a i ʻole ka puʻu puke i hoʻonoho ʻia 8 to 12 centimeters (3 to 5 inches) ma luna pono o ke kumu CPU. E hoʻololi i ka **Macro Lens a i ʻole 5x i 10x Hoʻonui ** a hoʻopaʻa i ka nānā ʻana i nā pine kumu.
3. E hoʻonohonoho i kahi Māmā Māmā ʻO 15 Degree Raking: Mai hoʻohana i ka uila ma luna o ke kelepona (e hana ana i ka ʻālohilohi). E kau i ke kukui LED kaawale ma ka ʻaoʻao o ka motherboard e ʻālohilohi ana ma luna o ke kumu ma kahi pāpaʻu 15-a-25-degree grazing angle. ʻO kēlā me kēia pine i pio ʻia 0.1 millimeters kū koke ʻo ia ma ke ʻano he ʻulaʻula keʻokeʻo a i ʻole kahi ākea ʻeleʻele e kūʻē i ka mānoanoa like ʻole.

KaʻAnuʻu Hana 2: E koho i ka pono micro-probe mea paahana a heleuma nā lima lima ʻelua¶

Mai hoʻopaʻa i kahi mea hana ma waena o ka lewa ma luna o kahi kumu LGA. Haʻalulu nā lima kākoʻo ʻole e 0.3 to 0.5 millimeters, ʻoi aku ka laulā ma mua o ke āpau ma waena o nā pine LGA ʻelua.

1. Nā Mea Hana Micro maikaʻi loa no nā Pin LGA:
2. Pono 28-Gauge i 30-Gauge ʻO ka nila ʻo Insulin Syringe (0.30 mm i 0.36 mm ke anawaena o waho) a i ʻole ka Pin Humuhumu Maikaʻi: Ua kūpono ka piko beveled ʻoʻoleʻa ma lalo o hoʻokahi 0.4 mm-pitch LGA cantilever lima me ka kuʻi ʻole i nā hoalauna.
3. Nā Tweezers ʻĀpana Micro-Tip (ESD-15 a i ʻole Watchmaker Forceps) a i ʻole #11 Scalpel Blade: He kūpono no ka wehe ʻana i nā maʻi maʻa a i ʻole ka hoʻihoʻi ʻana i kahi pine hili i hope i kona ala.
4. Ka heleuma lima lima ʻelua: E hoʻomaha i nā lima ʻelua ma luna o ka pākaukau a kau pono i kou ** manamana lima a me kou manamana lima ʻulaʻula ma luna o ke kumu metala CPU a i ʻole VRM heatsink**. E alakaʻi i ka piko o ka nila me kou lima nui me ka hoʻohana ʻana i ka manamana lima o kou lima ʻē aʻe e hoʻopaʻa i ke kumu nila. 1 centimeter maluna o na pine.

KaʻAnuʻu Hana 3: Nā hana hoʻoponopono kikoʻī no nā ʻano 4 o nā pine LGA i kulou¶

E hoʻohuli i kāu kukui kukui ʻaoʻao a puni nā ʻaoʻao ʻehā o ke kumu ma hope o kēlā me kēia hoʻololi liʻiliʻi:

• Mahi 1 - Laterally Skewed Pin (Tilted Left or Right Toward a Neighbor): Mai hoʻokuʻu i ka piko maʻemaʻe ma luna o ka pine. E hoʻohaʻahaʻa i ke kiko o kāu 30G nila i loko o ke ala ma ka ʻaoʻao o ka ** kumu waena (kuʻekuʻe) o ka lima cantilever**, a hoʻokuʻu mālie i ke kumu. 0.15 millimeters ʻaoʻao hoʻi i ke kikowaena o kona alahele (plus 0.05 mm ke kikowaena i hala e helu no ka elastic springback).
• Kahi 2 - Paʻa Paʻa ʻia a ʻImi ʻia paha (Noho Haʻahaʻa Loa Ma lalo o ka Grid): E hōʻoia i ke kuhikuhi ʻana i ke kiko o nā lima cantilever a puni (ka ** kuhikuhi palaoa**). E kaomi i ka piko o kāu 30G ka nila syringe a i ʻole ka niho niho ʻokiʻoki ma lalo o ka lima o luna o ka pine i hoʻomāʻewaʻewa, e neʻe mai ana mai ka ʻaoʻao ākea o ka makau, a hāpai mālie i luna a i mua ma ka piʻi ʻana. 0.2 millimeters a hiki i kona poʻo gula e hōʻike ana i ke kukui ʻaoʻao ma ke kiʻekiʻe like me kona mau hoalauna.
• Mahi 3 - Hoʻokiʻekiʻe ʻia a Hoʻopaʻa ʻia paha (Huki ʻia i luna e ka lole lole a i ʻole ka manamana lima): Mai kī pololei i lalo ma ka ʻaoʻao o ka piko. E kau i ka maka beveled palahalaha o kou nila ma hope o ka pihi luna o ka pine a e hahau malie ** i mua a i lalo ma kahi kihi 45-degere ma ka pali maoli o ka cantilever** no laila e pelu mālie ka lima puna i lalo a hiki i ke kiʻekiʻe like.
• Mahi 4 - Hoʻopiʻi ʻia ka Pin i 180 Degere i hope a i ʻole ma lalo o kahi hoalauna: Inā paʻa ma lalo o kahi hoalauna olakino, e hoʻohana i ka lua o ka nila e paʻa ai ka pine olakino. 0.1 mm ʻokoʻa e hoʻokuʻu wale i ka piko i paʻa. A laila, e hoʻoheheʻe i kou nila ma lalo o ka loop loop a hāpai mālie i ka lima ma ʻelua pae 45-degere. Inā haʻi loa ka pine i ka wā e wehe ana, e wehe i ka ʻāpana metala wehe me nā tweezers a hele i Mahele 4 (The Socket Pinmap Audit) ma lalo.

Mahele 4: ʻO ka Socket Pinmap Audit (he aha ka hopena inā hemo loa nā pine 1 a i ʻole 2?)¶

Loaʻa nā papa hana papa hana hou ma waena 1,331 a 1,851 nā pine, akā ma luna o 35 ka nui o ia mau pine he ʻeleʻele Ground (VSS) hoʻi, mana like (VCC) nā pine, a i ʻole i hoʻohana ʻole ʻia.RSVD) nā pā.

1. E hōʻoia ua hoʻokaʻawale ʻia ka ʻōpala i haki ʻia: Ma lalo 10x smartphone macro zoom, e hōʻoia i ka noho maʻemaʻe ʻana o ke koena metala ma lalo o ke kumu ʻilika puka pinhole i loko o kona pūnāwai a ʻaʻole pili i kahi pine pili**.
2. E helu i ka Lālani (Letter) a me ke Kolu (Number) Coordinates: E helu pono mai ke kihi kī (i hōʻailona ʻia e ka huinakolu ma ke kumu kumu) me ka hoʻohana ʻana i kāu kiʻi macro e hoʻoholo ai i ka hoʻonohonoho pololei o kāu pine i nalowale (e laʻana, Row AM, Column 24).
3. E hoʻopaʻa i ka palapala kuhikuhi kumu kumu: E nānā i ka Intel Core Processor Datasheet Volume 1 (Ballout and Pinout) PDF no LGA 1700 / 1851 a i ʻole nā papa kuhikuhi pinmap i wehe ʻia no AMD Socket AM5 (LGA 1718) a Socket AM4 (PGA 1331):

Mahele 5: Ka hōʻoia ʻana ma hope o ka hoʻoponopono hou ʻana a me ka palekana mua-boot protocol¶

1. E hana i ka 4-Angle Macro Photo Check (LGA Sockets): E kiʻi i nā kiʻi macro mai ka ʻaoʻao ʻĀkau, Hema, Hikina, a me ke Komohana ma lalo o ke kukui ʻaoʻao 15-degere e hōʻoia i ka noho ʻana o kēlā me kēia puʻupuʻu pili gula i ka laina ma ke kiʻekiʻe like me nā ʻāpana metala ʻole.
2. E hana i ka 1-Stick RAM + Heatsink Test Boot: E hoʻokomo i hoʻokahi lāʻau RAM i loko DIMM A2, hoʻomaha i kāu CPU cooler ma luna o ke kaʻina hana me ka dab of thermal paste, hoʻopili CPU_FAN, a me ka mana i ka wā e nānā ana i nā EZ Debug LEDs o ka motherboard (CPU -> DRAM -> VGA -> BOOT). Ke komo maʻemaʻe ʻo ia i ka UEFI/BIOS, pani ʻia, e hoʻokomo i kāu mau lāʻau RAM i koe ma ke ala ʻelua (A2 + B2), e kau pono i ka mea hoʻoluʻu, a hoʻopaʻa i loko CPU-Z a GPU-Z ʻo nā ala RAM a pau a PCIe x16 ʻeleu nā alahele.

Nā helu ulia pōpilikia āpana a me nā protocols oihana¶

ʻOiai ʻo ka CPU piʻo a me nā pine kumu ka mea nui o ka hoʻihoʻi hou ʻana i nā lako, kahi kaapuni pōkole uila i hoʻoikaika ʻia ma waena o nā kaila hoʻopuka mana kiʻekiʻe-amperage (150A to 250A) hiki ke hoʻoheheʻe i nā thermoplastics kumu, hoʻāla i nā resins PCB fiberglass, a i ʻole ke kumu i nahae ka capacitor:

• ** ʻAmelika Hui Pū ʻIa a me Kanada:** E kelepona koke iā 911 inā loaʻa i ka motherboard a i ʻole ka mana pōkole kaapuni i nā lapalapa ahi a i ʻole ka uahi nui ma hope o ka hemo ʻana i ka mana o ka pā AC. E hōʻike i nā ʻāpana kamepiula hoʻā ʻana iā ia iho i ka U.S. Komisina Palekana Huahana Kū'ai (CPSC) ma SaferProducts.gov aiʻole Health Canada Consumer Product Safety.
• United Kingdom: Kāhea iā 999 (a i ʻole 112) no nā pilikia ulia ahi. Ma lalo o ka UK Consumer Rights Act 2015, inā i hōʻea mai kahi motherboard hou mai kahi hale kūʻai aku me nā pine LGA i kulou ma lalo o ka uhi pale plastik (Dead on Arrival / Transit Damage), kū ma mua o ka hoʻopā ʻana i nā pine me kekahi mea hana, e kiʻi koke i ke kumu i wehe ʻole ʻia/i wehe koke ʻia, a koi i kahi mea kūʻai aku e pani ai i loko o 30 mau lā.
• Uni ʻEulopa: Kāhea i ka 112 no ke ahi ulia pōpilikia a i ʻole ka pane lapaʻau ma nā mokuʻāina lālā a pau o EU. Ma lalo o EU Directive (EU) 2019/771, ua hōʻike koke ʻia kekahi hemahema o ka conformity (e like me nā pine socket i hoʻopaʻa ʻia i ka hale hana ma ka lawe ʻana) ma hope koke o ka manaʻo ʻana ua loaʻa ka unboxing i ka manawa o ka lawe ʻana ke ʻole ka mea kūʻai aku e hōʻoia ʻē aʻe.
• Australia a me New Zealand: E kelepona iā 000 ma Australia a i ʻole 111 ma New Zealand no nā pilikia ahi. Hoʻokō ʻia nā hōʻoia ʻana o nā mea kūʻai aku ma ke kānāwai e ka Australian Competition and Consumer Commission (ACCC) a me Consumer Protection New Zealand.
• India a me Asia-Pacific: Kāhea i ka 112 ma India, 119 ma Iapana a me South Korea, a i ʻole 995 ma Singapore. No ka papa inoa piha honua, e ʻike helu pilikia.

Nīnau pinepine¶

E hoʻololi anei ʻo ASUS, MSI, Gigabyte, a i ʻole ASRock i kahi motherboard ma lalo o ka palapala hoʻopaʻa manuahi inā ʻaʻole wau i kuʻi hewa i nā pine socket CPU i ka wā e hoʻokomo ai?¶

Hoʻokaʻawale nā ​​palapala hōʻoia o ka hale hana maʻamau i nā pine LGA i hoʻopaʻa ʻia e like me ka Customer Induced Damage (CID) a kāpae iā lākou mai ka uhi palapala hoʻopaʻa manuahi ke ʻole hiki iā ʻoe ke palapala me nā kiʻi unboxing a i ʻole wikiō ua pio nā pine ma lalo o ka uhi plastik i ka wā i wehe ʻia ai ka pahu i hoʻopaʻa ʻia. Eia naʻe, hāʻawi ka ASUS, MSI, Gigabyte, a me ASRock i nā lawelawe hoʻololi CPU Socket Replacement Services (e kūʻai pinepine ʻia ma waena o $50 a me $120 USD ma muli o ke ʻano o ka ʻāina a me ke ʻano kumu), kahi e hoʻopau ai nā ʻenehana hale hana i ke kumu LGA i hoʻopōʻino ʻia ma kahi keʻena hana hou BGA infrared a kūʻai aku i kahi kumu kūʻai hou o ka hale hana ma mua o ka papa.

No ke aha i holo maikaʻi ai kaʻu PC ma hope o koʻu hoʻopaʻa ʻana i nā pine LGA i hoʻopaʻa ʻia, akā i kēia manawa ʻelua o kaʻu mau slot RAM ʻehā (Channel A a i ʻole Channel B) ʻaʻole i hana a hoʻomaka i kahi kukui DRAM melemele?¶

Ma kahi o ka hapalima o nā pine i loko o kahi uea socket Intel LGA 1700/1851 a i ʻole AMD AM5 pololei mai ka Integrated Memory Controller (IMC) o ka processor i nā ʻāpana keleawe e hānai ana i nā slot DDR4 a i ʻole DDR5 RAM. Inā hoʻopaʻa ʻia kekahi o nā pine āu i hoʻopololei ai i ka hema a i ka ʻākau mai luna mai akā e noho ana ʻo 0.2 millimeters haʻahaʻa haʻahaʻa loa, ʻaʻole hiki ke hoʻopaʻa paʻa i ka pilina puna i luna me ka pā gula palahalaha ma lalo o ka CPU, hoʻopau i ka Memory Channel A (slots A1/A2) a i ʻole Memory Channel B (slots B1/B2). Wehe i ka PPU, e nānā i nā pine i hoʻoponopono ʻia ma lalo o ke kukui ʻaoʻao 15-degere, a hoʻohana i ka nila 30G e hoʻokiʻekiʻe mālie i ka piko o ka pine i hoʻohaʻahaʻa ʻia i luna e 0.2 millimeters no laila e kaomi paʻa i ka pā CPU.

He aha kaʻu e hana ai inā ʻoki loa kahi pine gula paʻa i lalo o kaʻu kaʻina hana AMD AM4 Ryzen?¶

ʻO ka mua, mai hoʻolei i ke pine gula naha; e waiho i loko o kahi ʻeke liʻiliʻi i hoʻopaʻa ʻia. E nānā i ka palapala 'āina pinout AMD Socket AM4 no ka wahi kiko'ī o ka pine i nalowale: inā he pine VSS (Ground) a i ʻole RSVD (Reserved), e holo ana ke kaʻina hana ma 100 pakeneka paʻa me ka ʻole o ia. Inā he ala hoʻomanaʻo pono ka pine nalo, PCIe, a i ʻole pin boot, hiki i kekahi hale kūʻai hoʻoponopono micro-soldering uila uila (a i ʻole kiaʻi / mea hoʻohana laser-weld technician) hiki ke kūʻai aku i kāu pine i haki mua ʻia a i ʻole kahi pine hāʻawi mai kahi $10 AM4 Athlon processor i make i ka pā keleawe keleawe ma lalo o kāu CPU Ryzen ma kahi o 15 mau minuke.

Hiki iaʻu ke hoʻokuʻu i ka pine gula i haki ʻia i loko o ka lua e pili ana i kaʻu kumu motherboard AMD AM4 a kau i ka CPU ma luna o ia mea he hoʻoponopono pōkole?¶

ʻOiai ke kau ʻana i kahi pine PGA maʻemaʻe a haki pololei i loko o ka pinhole pili pono o kahi kumu AMD AM4 i kekahi manawa e ʻae i ka gravity a me ka socket cam clamp e kaomi i ke poʻo o ka pine hoʻokuʻu i ka papa hana i hiki iā ʻoe ke hoʻopaʻa hoʻokahi a hoʻihoʻi i nā faila wikiwiki, ʻaʻole hiki ke hilinaʻi ʻia no ka hoʻohana lōʻihi. ʻO ka hoʻonui ʻana i ka wela a me ka haʻalulu ke kumu o ka nalo ʻole ʻana o kahi pine i hoʻopaʻa ʻole ʻia a hoʻoheheʻe ʻia paha i loko o ka hale kumu, e hāʻule koke ai ka ʻōnaehana a paʻakikī ke kiʻi ʻana i ka pine me ka wehe ʻole ʻana i ka uhi o luna.

Pehea wau e ʻike ai i ka wā e wehe ʻia ai ka uhi poʻomanaʻo CPU plastic i ka wā o kahi hoʻonohonoho Intel a AMD AM5?¶

Mai ʻoki i ka uhi pale ʻeleʻele ʻeleʻele mai kahi waihona Intel LGA a i ʻole AMD AM5 me kou manamana lima ma mua o ka hoʻokomo ʻana i ka mea hana, no ka mea e waiho ana nā pine ʻeleʻele e ʻike i nā wili a me nā manamana lima a maʻalahi ke kuʻi i nā pine i ka wā e noho ana i ka CPU. Akā, waiho i ka uhi ʻili i paʻi ʻia ma ke kiʻi paʻa metala, wehe i ke kiʻi, kau mālie i ke kaʻina hana ma ke kumu i hoʻohālikelike ʻia me ka huinakolu kihi gula a me nā ʻaoʻao ʻaoʻao, a laila pani i ke kiʻi metala a hoʻopaʻa i ka lepa paʻa i lalo: ua hana ʻia ka uhi pale paʻa e paʻa maʻalahi iā ia iho ke kaomi ʻana o ke kiʻi metala ma nā kihi o ka CPU.

Hiki anei i kahi Intel LGA 1700 pili (anti-bending buckle) ke kumu i nā pine kumu i ka wā e hoʻokomo ai?¶

ʻAʻole e hoʻopōloli ke kiʻi hoʻopili CPU aluminika ma hope o ka mīkini (e like me ka Thermalright a i ʻole Thermal Grizzly Contact Frame) i nā pine kumu inā hoʻokomo pono ʻia ma luna o ka papa pākaukau pālahalaha, no ka mea, hoʻopuni ʻo ia i ka ʻaoʻao waho o ka mea hana me ka hoʻopā ʻole ʻana i ka lālani pine. Eia nō naʻe, hiki pinepine nā pine piʻi i ka wā e wehe ai nā mea kūkulu hale i nā ʻehā Torx T20 ʻehā o ka hale hana Intel ILM bracket ʻoiai ke kū pololei nei ka motherboard i loko o kahi pahu PC, e hoʻoheheʻe ai ka pale kila kila a i ʻole ke kua hexagonal koʻikoʻi ma hope o ka motherboard a hāʻule pololei i nā pine kumu i hōʻike ʻia. E hoʻouka mau i kahi kiʻi hoʻopili me ka motherboard e moe palahalaha ana ma luna o ke pākaukau a me ka CPU e noho mua ana i loko o ke kumu e pale ai i nā pine.

Nā alakaʻi pili¶

• Hoʻoheheʻe ʻia ke kumu hoʻoheheʻe wela a me ka wehe ʻana i ka heatsink paʻa
• ʻO ka gallium hui pū wai metala ma luna o ka motherboard a i ʻole nā ʻāpana GPU
• M.2 NVMe SSD e nalo ana i ka PCB kuʻu ʻole, ka wili ʻoki ʻia, a me ka hoʻopakele heatsink paʻa.
• Hoʻohui pū ʻia nā uwea lako mana modular, nā drive SATA SSD palai, a me ka hoʻopakele ʻana i nā pinout incompatibility
• ʻO ka wela nui o ka PC maʻamau a me ka pilikia leak wai anuanu

Nā kumu a me ke alakaʻi kūhelu¶

• Intel Corporation: Intel Core Processor Family Datasheet, Volume 1 & LGA1700 / LGA1851 Socket Mechanical Design Guide (Enabling Guide) (Cantilever contact spring deflection limitation, ILM clamping force specifications, and official pinout land assignment).
• ** Nā Manaʻo Micro Kiʻekiʻe (AMD):** AMD Socket AM5 (LGA 1718) a me Socket AM4 (PGA 1331) Hoʻokomo ʻana i ka Mea Hana Hana a me nā Kūlana Hoʻopau Heatsink (Mandatory thermal pre-warming and rotational twist removal protocols for PGA processors).
• IPC (Association Connecting Electronics Industries): IPC-A-610 ka ʻae ʻia o nā Electronic Assemblies a me IPC-7711/7721 Rework, Modification and Repair of Electronic Assemblies (Micro-mechanical contact pin alignment tolerances and ESD workstation controls).
• EIA / ECA (Electronic Components Association): EIA-364-1000 Environmental Test Methodology for Electrical Connectors and Sockets (Copper-beryllium spring fatigue limite and contact force normal force).