Liquid Metal Thermal Manna (Conductonaut/PS5) Zuba Kan Motherboard ko Abubuwan GPU: Safe Gallium Extraction¶

Zuba ko da ƙaramin ɗigon ɗigon ruwa na fili na ƙarfe na ƙarfe, kamar Thermal Grizzly Condutonaut, Cooler Master MasterGel Liquid, ko masana'anta PlayStation 5 (PS5) APU thermal interface abu, akan uwa uwa, mai sarrafa kayan aiki, ko bugu da katin zanen allon da'ira (PCB) gaggawa ce ta hardware. Ba kamar siliki mai launin toka na al'ada da manna na zinc-oxide ba, ƙarfen ruwa wani nau'in ƙarfe ne na eutectic wanda ya ƙunshi gallium, indium, da tin wanda ya rage ruwa a cikin ɗaki. Yana da kashi 100 cikin 100 na wutar lantarki kuma yana da tsaurin kima zuwa ga dandali na aluminum da ƙananan zafin jiki. Idan kun haɗu da gajeriyar wutar lantarki, hayaki, ko ƙamshi mai ƙonawa daga na'ura mai ƙarfi, yanke wutar AC nan da nan kuma tuntuɓi yankin ku. lambobin gaggawa idan wani bangaren wuta ya kunna. Don hanyoyin dawo da kayan masarufi masu alaƙa, duba jagororin mu akan An ciro CPU tare da heatsink ko lankwasa socket fil, PSU capacitor pop, 12VHPWR mai haɗa narke, da ƙanshin wutan lantarki a cikin PC, kuma al'ada PC overheating da ruwa mai sanyaya yayyo triage.

Saboda karfen ruwa yana da matsanancin tashin hankali na sama, squirt guda ɗaya daga syringe plunger wanda ke wargajewa ba zato ba tsammani zai iya ƙaddamar da ɗimbin ƙanana, masu haske na azurfa har zuwa santimita 15 (inci 6) na kewayen uwa. Idan ko da ƙananan ƙananan millimita gadoji biyu kusa da Surface Dutsen Na'ura (SMD) multilayer yumbu capacitors (MLCCs) a kusa da fallasa GPU mutu, ko mirgine a ƙarƙashin Ball Grid Array (BGA) kunshin na VRAM module ko AMD AM5 processor heatspreader, kunna wutar lantarki zai kai high-amperage 112. ƙofofin. Koyaya, muddin ba ku yi amfani da wutar lantarki ba kuma kar ku shafa ƙarfen ruwa da busassun tawul ɗin takarda ko goga mai ƙarfi, za a iya fitar da kashi 100 na gallium da aka zubar cikin aminci ba tare da lahani na dindindin ba.

Yi wannan yanzu¶

1. ** Cire kebul na wutar AC kuma cire baturin CMOS (ko kwamfutar tafi-da-gidanka/console mai haɗa baturi na ciki) nan da nan.** Kada a taɓa na'urar don gwada ko ƙaramin zube yana da matsala. Ko da ikon jiran aiki (+5VSB a kan ATX motherboard ko kwamfutar tafi-da-gidanka da aka haɗa ta lithium-ion baturi) yana ƙarfafa layin dogo wanda zai ɗan gajeren kewaya gadojin gallium nan take gadajen capacitor guda biyu.
2. Dakatar da motsi, karkata, ko girgiza motherboard, katin zane, ko chassis na wasan bidiyo. Karfe na ruwa yana da ƙarancin danko sosai kuma kusan sifili jujjuyawar abin rufe fuska na fiberglass ɗin da ba a taɓa gani ba har sai ya yi oxidizes. Karɓar allon yana haifar da sassaƙaƙƙen sassa don mirgina cikin sauri a cikin PCB kuma su zamewa ƙarƙashin kwakwalwan ƙwaƙwalwar BGA baki, ramukan PCIe, ko gidajen soket na CPU inda ba a iya ganin su daga sama.
3. Kada a goge zubewar da busasshiyar tawul ɗin takarda, nama, ko busasshiyar auduga. Shafa ƙarfen ruwa a saman PCB yana shear haɗin gwal ɗin azurfa guda ɗaya mai tsayin millimita 2 (0.08-inch) cikin dubunnan ɗigo guda 10 na microscopic waɗanda ke shafa a cikin wani ɗan ƙaramin ƙarfe na bakin ƙarfe a kan ganyayen solder da fiberglass.
4. Da farko sai a tsotse duk wani beads na ruwa da ake iya gani da farko ta amfani da sirinji mai tsafta mai tsafta ko kuma allurar tsotsa robobin baƙar fata wanda aka haɗa tare da bututun ƙarfe na ruwa. Taɓa tip ɗin allurar kai tsaye zuwa gefen kowace dutsen azurfa sannan a ja mai tsotsa a hankali don haka tashin hankali na saman yana jan duk digo a cikin ganga.
5. ** Bincika ko wani ƙarfe na ruwa ya taɓa aluminium maras kyau (kamar na'urar sanyaya aluminium CPU mai ƙyalƙyali, tari na GPU fin, ko M.2 heatsink).** Idan gallium ya taɓa ɗanyen aluminum, goge shi cikin daƙiƙa ta amfani da kashi 99 na isopropyl barasa. Gallium yana bazuwa cikin sauri zuwa cikin iyakokin hatsi na aluminum, yana haifar da bala'i na Liquid Metal Embrittlement (LME) wanda ke juyar da ingantaccen tsarin aluminium zuwa crumbling foda mai toka a cikin sa'o'i.
6. Yi amfani da 99% isopropyl barasa (IPA) jika-dabbing da coalescing hanya don ɗaga sauran micro-beads daga SMD capacitors. Jika lint-free kumfa swab ko auduga applicator da kashi 99 m IPA da kuma dab a tsaye a kan kananan beads. Fim ɗin barasa yana ɗaukar fata gallium mai oxidized kuma yana ba da damar ƙananan beads su sake haɗuwa zuwa wani yanki mai girma wanda ke manne da rigar tip don ɗagawa tsaye.

Bishiyar yanke shawara: Gwaninta zubewar karfe ta wurin wuri da kayan saman¶

Yi amfani da wannan taswirar kwarara don tantance ainihin hanyar haƙar inji da sinadarai dangane da inda gallium gami ya sauka.

flowchart TD
    A["An Gano Zuba Karfe Na Ruwa akan PC, Laptop, ko Console"] --> B{"An yi amfani da wutar lantarki BAYAN da zubewar ta faru?"}
    B -->|"Ee: PC ya kasa yin taya, ya kunna, ko rufewa"| C["Yanke AC da ƙarfin baturi -> Cire duk ƙarfe na ruwa -> Bincika gajeriyar capacitors SMD tare da multimeter a cikin Ci gaba / Yanayin Diode kafin sake ƙarfafawa."]
    B -->|"A'a: Zubewa ya faru yayin taro ko kulawa"| D{"Ina karfen gallium ya sauka?"}
    D -->|"Flat PCB Solder Mask ko GPU/CPU Die Surface"| E["Shuke beads masu girma tare da sirinji na filastik -> Wet-dab micro-spheres a tsaye tare da 99% IPA swab -> Coalesce da ɗagawa"]
    D -->|"Matsakaicin SMD Capacitors (CPU/GPU substrate ko VRM)"| F["KADA KA shafa gefe -> Yankin ambaliya tare da 99% IPA -> Dab a tsaye tare da kumfa mai nuni -> Rufe tare da mai tsabtace tuntuɓar lantarki a ƙaramin matsi"]
    D -->|"Ciki LGA/AM5/AM4 CPU Socket ko PCIe Slot"| G["KADA KA goge fil -> Ƙirar manyan beads tare da kyakkyawan tip filastik 27G-30G -> A hankali ɗaga ƙananan beads tare da filament goga guda ɗaya na IPA a ƙarƙashin 10x loupe"]
    D -->|"Ƙarƙashin BGA Chip (VRAM, GPU Core, Southbridge)"| H["karkatar da jirgin dan kadan zuwa mafi kyawun buɗaɗɗen buɗaɗɗen -> Ambaliyar ƙasa tare da 99% IPA ta hanyar sirinji -> Zamewa siririn 0.05 mm filastik filastik ko tsiri don zana beads."]
    D -->|"Akan Heatsink Baseplate ko Fin Stack"| I{"Wanne karfe ne heatsink ya yi?"}
    I -->|"Bare Copper ko Nickel Plated Copper"| J["SAFE: Gallium yana samar da tabo na amalgam mara lahani -> Tsaftace wuce haddi tare da 99% IPA -> Yaren mutanen Poland da sauƙi tare da goge na ƙarfe ko yashi mai yashi 2000-grit idan lumpy"]
    I -->|"Bare Extruded ko Cast Aluminum"| K["MUHIMMAN HAZARD: Ruwan ƙarfe na ruwa -> Shafa nan da nan tare da 99% IPA -> Yashi mai launin toka mai launin toka -> Yi watsi da heatsink idan ƙarfe ya rushe ko rami."]

Fahimtar ilimin kimiyyar lissafi da ƙarfe na gallium liquid metal¶

Don share zubewar karfen ruwa ba tare da yin muni sau goma ba, dole ne ku fahimci kaddarorin jiki guda uku waɗanda ke yin eutectic gallium-indium-tin (GaInSn, yawanci a kusa da 68.5 bisa dari gallium, 21.5 bisa dari indium, da kuma 10 bisa dari tin da nauyi) suna nuna bambanci da silicone thermal manna ko mercury:

1. Matsanancin ƙarfin lantarki da ƙananan gada¶

Daidaitaccen manna mai zafi (irin su Arctic MX-4, MX-6, Noctua NT-H1, ko Kryonaut) suna dakatar da barbashi yumbu marasa aiki (aluminum oxide, zinc oxide, ko boron nitride) a cikin mai ɗaukar siliki. Ko da kun shafa madaidaicin manna a cikin fallasa capacitors na GPU, yana aiki azaman insulator na lantarki. Karfe mai ruwa, akasin haka, ƙarfe ne mai tsaftataccen narkakkar da wutar lantarki da ya wuce Siemens miliyan 3.1 a kowace mita. Saboda fakitin CPU na zamani (kamar AMD Ryzen AM5 saman, Intel Core substrates, da kwamfutar tafi-da-gidanka BGA sun mutu) da katunan katunan zane suna kewaye da siliki ya mutu tare da adadi mai yawa na 0201-size da 0402-size decoupling capacitors wanda ke nesa da ƙasa da 0.25 millimeters (0.01 inci) baya, ƙarancin ƙarancin ƙarfe zai iya buɗe ido. da kushin kasa na capacitor.

2. Samuwar fata gallium-oxide nan take (me yasa karfen ruwa ke shafawa idan an goge bushewa)¶

Gallium ruwa mai tsabta yana da wurin narkewa na 29.76 digiri Celsius (digiri 85.57 Fahrenheit), kuma idan aka haɗa shi da indium da tin, wurin narkewar sa yana raguwa ƙasa da digiri 10 Celsius (digiri 50 Fahrenheit). Lokacin da aka fallasa shi zuwa iskar oxygen a cikin iska, saman saman ɗigon ruwa na ƙarfe na ruwa yana amsawa a cikin millise seconds don samar da ƙaramin ɗan ƙaramin fata na gallium (III) oxide (III).Ga2O3) kauri kaɗan kawai nanometers:

• Lokacin da ba'a taɓa shi ba: Digon ruwa yana yin kama da ɗan ƙaramin balloon ruwa wanda ke ɗauke da matsanancin tashin hankali na ciki (kimanin 0.5 zuwa 0.7 Newtons a kowace mita).
• Lokacin da aka goge: Idan ka ja busasshen swab ɗin auduga ko tawul ɗin takarda a kan ɗigon ruwa, za ka fasa fatar gallium-oxide kuma ka danna ƙaramin ƙarfen ruwan ciki da aka fallasa da ƙaƙƙarfan rubutu na PCB solder mask ko yumbu capacitors. Fatar oxide da ta fashe nan da nan ta sake yin gyare-gyare tare da sanya karfen da aka shafa a sama kamar jikakken fenti na azurfa, ta bar baya da smear mai launin toka da dubban ƙananan beads.
• ** Me yasa kashi 99 na barasa isopropyl (IPA) ke aiki: ** Yayin da isopropyl barasa ba ya narkar da ƙarfe na ruwa (karfe ba sa narkewa a cikin barasa), ambaliya da katako tare da kashi 99 cikin 100 na IPA yana kawar da iska, yana lubricates saman ƙarƙashin fata na gallium-oxide, yana rage mannewar tsaka-tsakin tsaka-tsaki a kan PCB, kuma yana haifar da tarwatsewar ƙwayar cuta tare da PCB. Wurin da za a iya dagawa a tsaye.

3. Liquid Metal Embrittlement (LME) na aluminum vs. benign amalgamation da jan karfe¶

Liquid gallium yana mu'amala daban-daban tare da karafa a cikin kwamfutoci:

Ƙa'idar hakar mataki-mataki: Tsaftace ƙarfe na ruwa daga PCBs da SMDs¶

Yi aiki a cikin sarari mai haske, mara tsari tare da waɗannan kayayyaki:

• Mafi Girma: A 10x saitin kayan ado na kayan ado, microscope na USB, ko kyamarar wayar hannu da aka saita zuwa 5x ku 8x zuƙowa tare da filashin LED a kunne.
• ** Kayan aikin tsotsa: ** Baƙar fata mai baƙar fata Luer-kulle allurar da sirinji 1-milliliter wanda aka haɗa tare da ƙarfen ruwan ku, ko bututun filastik mai tsabta.
• Magani:** ** kashi 99 tsantsar barasa isopropyl anhydrous (IPA)** (kauce wa kashi 70 cikin 100 na shafa barasa) da gwangwani na ** filastik-amintaccen mai tsabtace kayan lantarki**.
• Masu buqata: Fitilar kumfa mai tsafta, swabs ɗin auduga mai rauni sosai, buroshin fenti na nylon mai kyau, da tef ɗin fenti mai ƙaranci ko polyimide (Kapton).
• Tsarin abun ciki: Tushen yumbu ko ƙoƙon filastik wanda aka jera shi da tawul ɗin takarda mai ɗanɗano don fitar da dunƙulen gallium da aka tattara a ciki.

Mataki na 1: Bulk bead (bushewar tsotsa)¶

1. ** Taswirar yankin zube karkashin haske mai kusurwa:** Hana hasken walƙiya mai haske a kan PCB a ƙaramin kusurwa 15-mataki. Beads na ƙarfe na ruwa suna nuna haske kamar ƙananan ƙwallon ƙwallon chrome, suna tsaye sosai a gaban abin rufe fuska baki ko kore. Bincika har zuwa santimita 20 (inci 8) nesa da soket na CPU ko GPU, gami da cikin ramukan RAM, ramukan M.2, da masu haɗin wuta.
2. Ki nemi kowane dutsen da ya fi milimita 0.5 (inci 0.02): Haɗa baƙar fata baƙar fata a kan sirinji na ƙarfe na ruwa, tura mai jujjuya ƙasa don fitar da iska, taɓa tip ɗin a hankali a gefen dutsen ƙarfe na ruwa, sa'annan ku ja mai tsutsa baya a hankali.
3. Yi amfani da dabarar “mother-bead coalescence trick” don madaidaitan kududdufai: Idan ƙaramin digo ya ƙi shigar da tip ɗin sirinji da kansa, sai a tura ɗan ƙaramin ƙarfen ƙarfen ruwa a tsakiyar ƙarshen sirinji ɗinka don ya rataya akan bututun ƙarfe, taɓa wannan ɗigon rataye zuwa digon da ya zube a kan allo, sannan a ja baya. Saboda ƙarfen ruwa yana da ƙaƙƙarfan alaƙar haɗin kai don kansa, ɗigon da ya zube yana shiga cikin dutsen da ke rataye a kan titin sirinji ɗin ku kuma yana tsotse ciki.

Mataki na 2: Ciro ƙananan beads daga maɗaukakin ƙarfin ƙarfin SMD (CPU/GPU substrates)¶

Yankin da ya fi hatsarin zubewa shine ƙaramin zobe na ƙananan kayan kwalliyar yumbu mai launin toka da ke kewaye da kwamfutar tafi-da-gidanka maras amfani da CPU ko GPU mutu, yankewar zafi na AMD Ryzen AM5, na'urar sarrafa Intel, ko fakitin PlayStation 5 APU.

1. ** Ambaliya layin capacitor tare da barasa isopropyl kashi 99:** Yi amfani da dropper ko sirinji don sanya digo 3 zuwa 4 na kashi 99 cikin 100 na IPA kai tsaye akan gurɓatattun capacitors na SMD don haka suna nutsewa cikin madaidaicin tafki na barasa.
2. ** Dabba a tsaye tare da swab mai nunin kumfa mai IPA:** tsoma swab mai nuni a cikin kashi 99 na IPA. Latsa rigar tip ** kai tsaye ƙasa a tsaye ** akan capacitors kuma ɗaga kai tsaye. Kada a goge shi a kwance, wanda zai iya ƙwace ƙaramin capacitor 0201 ya fizge shi daga pads ɗin sayayya ko karya gallium zuwa ƙananan barbashi.
3. ** Coalesce kama beads a tarko daga tsakanin capacitor gibba:** Karkashin 5x ku 10x girma, yi amfani da bristle nailan mai laushi guda ɗaya daga goga mai tsaftataccen ruwa mai tsabta (ko tip ɗin haƙori na katako wanda aka zubar da shi zuwa kyakkyawan ma'ana kuma an jika shi cikin kashi 99 cikin 100 na IPA) don a hankali kwance ƙwanƙolin azurfa daga ƙaramin rata tsakanin capacitor guda biyu zuwa cikin buɗaɗɗen barasa. Da zarar ƙananan beads sun taɓa juna a cikin tafkin barasa, sai su shiga cikin babban yanki wanda za ku iya ɗaga kai tsaye tare da rigar swab ko sha'awar tare da sirinji.
4. A jefar da swab kowane dabo 3 zuwa 4: Da zarar swab tip ya debi ɗigon azurfa, a jefar da shi sannan a ɗauko swab ɗin sabo. Sake amfani da swab mai ƙazanta yana sake ajiyar ƙananan beads akan masu ƙarfi mai tsabta.

Mataki na 3: Ciro karfen ruwa da aka makale a ƙarƙashin kwakwalwan BGA (VRAM, GPU core, ko chipset)¶

Idan karfen ruwa ya birgima daga gefen GPU mutu ko na'ura mai sarrafa PlayStation 5 kuma ya zamewa cikin tazarar iska mai girman 0.3-millimita (0.012-inch) kusa da guntuwar GDDR6 VRAM na kusa ko kuma ƙarƙashin gefen na'urar sarrafa BGA, swab na al'ada ba zai iya isa gare ta ba.

+-----------------------------------------------------------------------+
|  FLUSHING GALLIUM BEADS FROM UNDERNEATH A BGA CHIP (VRAM / GPU)       |
|                                                                       |
|       [ Black BGA VRAM Chip ]                                         |
|       =======================                                         |
|        ( ) ( )  * <-- Trapped Gallium Bead between Solder Balls       |
|       ---------------------------------------------------------       |
|       [ Green/Black Fiberglass PCB ]                                  |
|                                                                       |
|  1. Tilt PCB at 30 degrees with a folded paper towel taped against    |
|     the lower exit edge of the BGA chip as a catch-dam.               |
|  2. Inject 99% Isopropyl Alcohol through the upper edge of the chip   |
|     using a blunt plastic syringe to float the oxide skin loose.      |
|  3. Slide a 0.05 mm strip of smooth Parchment Paper or Kapton film    |
|     soaked in 99% IPA through the under-chip gap to sweep beads out.  |
+-----------------------------------------------------------------------+

1. ** Gina dam ɗin kama-karya a gefen fita: ** Ninka wani zane na microfiber mara lint ko matattarar kofi wanda aka dasa shi da kashi 99 na IPA kuma danna shi da ƙarfi a gefen ƙananan guntu na BGA inda kake son ƙarfen ruwa ya fita, don haka ƙwanƙwasa ƙwanƙwasa ba sa mirgine cikin guntu makwabta.
2. ** karkatar da PCB a kusurwar digiri 30-zuwa-45 kuma allurar kashi 99 IPA daga gefe guda:** Cika sirinji mai tsabta tare da barasa isopropyl kashi 99, sanya bututun ƙarfe a kan babban guntu na BGA, da kuma zurfafa ruwan barasa a ƙarƙashin guntu. Saboda barasa na isopropyl yana da ƙananan tashin hankali (21.7 millinewtons a kowace mita), yana gudana ta hanyar BGA solder-ball grid kuma yana yawo sassan gallium mai laushi a kan tufafin kama.
3. ** Share tazarar tare da takarda takarda 0.05-millimita (0.002-inch) ko fim ɗin fim ɗin polyimide: ** Yanke kunkuntar kunkuntar mai faɗin 3-millimita (0.12-inch) mai tsabta ** takarda mai baƙar fata mai rufi, takarda firinta, ko bakin ciki na Kapton polyimide tef (tare da madaidaicin tef ɗin polyimide). Jika tsiri tare da kashi 99 na IPA, zame shi a hankali a ƙarƙashin gefen guntu na BGA tsakanin layuka na ƙwallo, kuma zana shi zuwa ga zanen kama. Yi nazarin tsiri a ƙarƙashin haɓakawa bayan kowace wucewa; maimaita tare da sabobin tube da IPA flushes har sai biyar a jere sun fito ba tare da tsabar azurfa ba.
4. Yi kurkure mai tsaftar ƙarancin matsi na ƙarshe: Rike allon a kusurwar digiri 45 akan tiren sharar gida sannan a fesa rafi na ** filastik-amintaccen mai tsabtace na'urar lantarki ** ta ratar da ke ƙarƙashin guntu don wanke barbashi masu ɗorewa.

Mataki na 4: Ciro ƙarfe na ruwa daga AMD AM5, AM4, ko Intel LGA motherboard soket¶

Idan digo na ƙarfe na ruwa ya faɗi cikin buɗaɗɗen fil na Intel LGA1700/LGA1851 ko AMD AM5 soket na uwa (duba An ciro CPU tare da heatsink ko lankwasa socket fil don makanikai na fil):

1. Kada a taɓa jan swab zuwa ƙugiya na LGA: Ganyen beryllium-jan karfe mai siffar J mai siffar zinari yana zuwa cikin lanƙwasa soket na LGA nan take idan an kama shi.
2. Yana kwantar da soket don ƙarfafa ƙwanƙwasa: Ajiye katakon uwa mara ƙarfi a cikin jakar da ba ta da ƙarfi (tare da fakitin bushewa don hana ƙazanta) a cikin injin daskarewa. -18 degrees Celsius (0 degrees Fahrenheit) na tsawon mintuna 45, ko kuma taɓa ɗigon ruwa a taƙaice tare da sanyi tip ɗin allurar ɗinki na ƙarfe da aka yi sanyi a cikin busasshiyar ƙanƙara, na iya lalata ƙwanƙwasa da daskare dutsen a cikin wani ƙaramin pellet na azurfa wanda za ku iya ɗaga kai tsaye daga fitilun soket tare da daidaitattun tweezers marasa maganadisu ba tare da raba shi zuwa ƙananan ɗigon ruwa ba.
3. Hanyar ruwa a ƙarƙashin haɓakawa: Idan ana cirewa a cikin ɗaki, ambaliya fil ɗin soket ɗin da abin ya shafa tare da kashi 99 na IPA ta amfani da eyedropper. Yi amfani da ** 30-ma'auni na filastik IV catheter sheath ** akan sirinji (ko bristle na fenti na nailan guda ɗaya wanda aka jika da IPA) an shafa shi sosai a cikin diagonal alƙaluman LGA suna nunawa don ɗaukar dutsen dutsen azurfa har zuwa ƙarshen fil inda rigar kumfa za ta iya taɓa shi a tsaye kuma ya ɗauke shi.

Cire tabon oxide mai launin toka da aka bari akan abin rufe fuska na PCB ko jan karfe¶

Bayan cire kowane ƙwanƙwasa mai siffar ƙarfe na ruwa, za ku iya lura da smudge mai launin toka a kan abin rufe fuska na PCB, jikin yumbu, ko farantin sanyi na heatsink.

• ** Akan Copper ko Nickel Cold Plates:** Tabon azurfa-launin toka a kan heatsink na tagulla shine ƙaƙƙarfan Layer na ƙarfe-gallium intermetallic (CuGa2). Ba shi da illa kuma baya buƙatar cirewa. Idan kuna juyawa zuwa manna mai zafi na al'ada kuma kuna son shimfidar wuri mai santsi, shafa digo na ** ƙarfe mara nauyi ** zuwa heatsink na jan karfe ** yayin da aka cire shi gaba ɗaya daga PC **, goge tare da zanen microfiber, kuma kurkura da kashi 99 na IPA.
• ** Akan PCB Solder Mask da SMD Capacitors:** Wani siriri mai launin toka mai launin toka akan PCB fim ne na ** gallium(III) oxide (Ga2O3) gauraye da tarkacen karfen da ba su gani ba**. Tsaftace ta ta hanyar jika swab mai nuni da 99% IPA, mirgina swab tip a baya a kan smudge (kamar abin nadi maimakon gogewa), da zubar da swab da zarar ya zama launin toka. Yi maimaita tare da sabbin swabs har sai auduga ya zo fari kuma abin rufe fuska yana da tsabta a ƙarƙashinsa 10x girma.

PlayStation 5 (PS5) da masana'antar kwamfutar tafi-da-gidanka na wasan caca ruwa mai zubewar mai¶

Sony's PlayStation 5 consoles da kuma manyan kwamfyutocin caca masu yawa (kamar ASUS ROG Zephyrus, Strix SCAR, da samfuran Alienware) daga masana'anta tare da ƙarfe mai ruwa akan APU ko CPU mutu kewaye da shingen shingen kumfa polyurethane mai buɗewa da takaddar rufewa akan madaidaicin SMD da ke kewaye.

1. ** Binciken "PS5 Vertical Dry Spot" vs. Barrier Breach:** Bayan lokaci, hawan keke na thermal akan PS5 ko kwamfutar tafi-da-gidanka na wasan kwaikwayo na iya haifar da tafkin ruwa na karfe a kan silicon ya mutu ya mutu kuma ya koma baya, yana barin busassun launin toka mai launin toka a kan siliki crystal wanda ke haifar da rufewar zafi. Muddin karfen ruwa ya kasance a cikin gasket ɗin kumfa na baki a kusa da APU, yana da ** ba *** ya rage motherboard: tsoma swab mai tsabta a cikin kashi 99 na IPA, a hankali shafa launin toka mai launin toka a kan silicon mutu da jan ƙarfe heatsink block don karya ɓawon burodi na oxide, da kuma sake rarraba ruwa na masana'anta a ko'ina cikin duka saman biyu.
2. Idan Factory Liquid Metal Ya Fasa Dam ɗin Kumfa yayin Watsewa: Idan kun ɗaga PS5 ko kwamfutar tafi-da-gidanka heatsink da ƙarfen ruwa da suka zube a wajen kumfa gasket a kan motherboard, bi matakai na 1 zuwa na 3 na sama don cire kowane katako daga allon, sannan ku duba gas ɗin kumfa na masana'anta kafin sake haɗuwa. Idan dam ɗin kumfa ya tsage, baƙaƙe, ko kuma an jika shi da gallium, maye gurbin gasket ɗin kumfa (ko shafa riguna biyu na ** share fage na silicone conformal shãmaki / Thermal Grizzly Shield shãmaki ** a kan duk kewaye SMD capacitors kuma bar shi ya warke na minti 30) kafin sake amfani da heatsink.

Tabbataccen ƙarfin iko: Multimeter gwajin gajeriyar kewayawa da sulke mai shinge¶

Kar a taɓa toshe igiyar wutar baya ciki bisa kallon yau da kullun. Kammala wannan tabbatacciyar wutar lantarki ta matakai huɗu da farko:

1. ** The 10x Duban Hasken Wuta mai kusurwa:** Duba kowane milimita murabba'in na ma'aunin CPU/GPU, matakan VRM na kusa, ramin RAM, da bayan PCB a ƙarƙashin 10x haɓakawa yayin motsi fitilar LED mai haske a cikin da'irar 360-digiri. Idan babu abin da ke haskaka azurfar ƙarfe, tsabtace gani ya cika.
2. ** Ci gaban Multimeter / Resistance Bincika A Gaba ɗaya Ƙarfafa Ƙarfafawa:** Saita multimeter na dijital zuwa ** Ci gaba ko Ƙananan Ohms (200 ohm zango)**. Taɓa bincike ɗaya zuwa wuri na ƙasa (kamar madaidaicin PCIe na ƙarfe) kuma a hankali taɓa sauran binciken zuwa ƙarshen ma'aunin SMD inda zubewar ta faru:
3. Gefe ɗaya na kowane capacitor mai haɗawa yana haɗi zuwa Ground (0.0 to 0.5 ohms), yayin da kishiyar gefen ke haɗuwa zuwa tashar jirgin ruwa.
4. Babban tushen GPU na yanzu (NVVDD / VDDGFX) da kuma CPU Vcore Rails a zahiri suna da ƙarancin juriya ga ƙasa (** sau da yawa 0.4 to 2.5 ohms**), don haka ƙananan karatun ohm akan core capacitors al'ada ne. Duk da haka, 12V, 5V, 3.3V, kuma 1.8V / 1.2V ya kamata a karanta daga *20 ohms zuwa kilo-ohms da yawa ***. Idan a 12V ko 3.3V dogo yana karantawa 0.0 ohms ya mutu daga ɗan gajeren ƙasa, har yanzu akwai gadar ƙarfe ta ruwa da ke ɓoye ƙarƙashin wani abu.
5. ** bushe gaba daya na mintuna 60:** Bari allon da aka goge ya zauna a ƙarƙashin fitilar tebur mai dumi ko fan na tsawon mintuna 60 don haka duk sauran ƙarfi da ke cikin tarko a ƙarƙashin fakitin BGA ya ƙafe gaba ɗaya.
6. ** Aiwatar da Rubutun Tsare-tsaren Kaya Kafin Sake Amfani da Karfe Liquid:** Idan kuna shirin ci gaba da amfani da ƙarfe na ruwa, toshe riguna na bakin ciki guda biyu na **Thermal Grizzly TG Garkuwa , ** MG Chemicals 422C Silicone Conformal Coating, ko kunsa kewaye da ** high-zazzabi polyimide (Kapton) ba zai taɓa taɓawa gaba ɗaya ba.

Lambobin gaggawa na yanki da ka'idojin hukumar¶

Yayin da zubewar ƙarfen ruwa a kan jirgi mara ƙarfi shine gaggawar kayan aiki, gajeriyar da'ira mai ƙarfi akan katunan zane mai ƙarfi (450W ku 600W 12VHPWR rails) ko kwamfutar tafi-da-gidanka na lithium-ion na iya haifar da gobarar abubuwa, hayaki, ko guduwar baturi:

• Amurka da Kanada: Kira 911 nan take idan baturin PC ko kwamfutar tafi-da-gidanka na gajeriyar kewayawa ya fara shan taba, yana haskakawa, ko kuma ya shiga cikin gudu na thermal. Don faɗuwar fata, ido, ko kamuwa da cutar gallium-indium-tin mahadi, kira ** Sarrafa guba a 1-800-222-1222** (US) ko 1-844-POISON-X / 1-844-764-7669 (Kanada). Bayar da rahoton haɗarin wuta na lantarki ga *U.S. Hukumar Kare Kayayyakin Mabukaci (CPSC) a SaferProducts.gov.
• United Kingdom: Kira 999 (ko 112) don gobarar lantarki ko gaggawar baturi. Don shawarwarin bayyanar da sinadarai marasa gaggawa, kira NHS 111 don isa ga National Poiss Information Service (NPIS) jagora.
• Ƙungiyar Tarayyar Turai: Kiran kira 112 a duk ƙasashe membobin EU don gaggawar gobara da likita. Abubuwan da aka sayar da thermal a cikin EU suna ɗaukar Dokar GASKIYA / CLP (EC No 1272/2008) Sheet Data Safety (SDS)** da ke ba da cikakken bayani game da sarrafa gallium gami.
• ** Ostiraliya da New Zealand:** Kira 000 a Ostiraliya ko 111 a New Zealand don sabis na wuta ko gaggawa. Don bayyanar da sinadarai ko ƙarfe, kira ** Cibiyar Bayanin Guba ta Australiya a 13 11 26** ko ** Cibiyar Guba ta Ƙasar New Zealand a 0800 764 766**.
• Indiya da Asiya-Pacific: Kiran kira 112 a Indiya (ko 101 don Wuta), 119 a Japan da Koriya ta Kudu, ko 995 a Singapore. Tuntuɓi cikakken littafinmu na lambobin gaggawa.

Tambayoyin da ake yawan yi¶

Shin man ƙoshin ƙarfe na ruwa yana da haɗari don taɓawa da hannaye ko shaƙa?¶

Ganyayyaki na thermal na ruwa na kasuwanci (irin su Thermal Grizzly Conductonaut, Cooler Master MasterGel Liquid, da masana'anta PS5/ASUS ROG ruwa karfe) sune eutectic alloys na gallium, indium, da tin waɗanda basu da ƙarfi kuma basu ƙunshi mercury mai guba ko gubar ba. Suna haifar da hayaki mai guba a ɗaki ko kwamfuta yanayin yanayin aiki kuma ba sa sha ta cikin lafiyayyan fata, kodayake Takaddun Bayanan Tsaro sun ba da shawarar sanya safofin hannu na nitrile saboda gallium yana jika mai fata nan da nan kuma ya bar launin toka smudge. A wanke fata da sabulu, ruwan dumi, da kuma shafa barasa bayan saduwa.

Menene zai faru idan ƙaramin ɗan ƙaramin ƙarfe na ruwa ya taɓa heatsink na aluminum na daƙiƙa 10 kacal?¶

Idan karfen ruwa ya sauka a kan wani anodized ko fentin aluminum heatsink kuma ka shafe shi da kashi 99 na isopropyl barasa a cikin dakika 10 zuwa 30 kafin ya fashe ta hanyar kariya ta oxide Layer, heatsink yawanci ba shi da rauni. Duk da haka, idan gallium alloy ya zauna a kan danda ba a yi amfani da aluminum ba kuma ya bar wani wuri mai duhu-launin toka ko rami mai laushi, gallium ya riga ya fara yaduwa a cikin iyakokin hatsi na aluminum ta hanyar Liquid Metal Embrittlement, kuma wannan ɓangaren aluminum dole ne a jefar da shi saboda tsarin tsarin sa zai ragu a cikin sa'o'i 24 zuwa 72 na gaba.

Me yasa heatsink na tagulla ya juya azurfa mara nauyi inda karfen ruwa ya taba shi, kuma ya lalata min sanyaya?¶

Tabon azurfa-launin toka a kan farantin sanyin CPU na jan ƙarfe mara nauyi ko ɗakin tururi na kwamfutar tafi-da-gidanka na al'ada ne kuma baya lalata heatsink. Gallium yana amsawa tare da ƴan ƙananan micrometers na jan ƙarfe maras kyau don samar da ingantacciyar Layer na ƙarfe-gallium intermetallic gami (`CuGa2`), wanda ya kasance mai tafiyar da zafin jiki kuma baya haifar da haɓakar tsarin kamar aluminum. Kuna iya barin tabon azurfa kamar yadda yake kuma ku shafa sabon manna mai zafi akansa, ko kuma goge duk wani ƙaƙƙarfan shimfidar lebur ta amfani da rigar rigar 2000-grit kafin tsaftacewa da kashi 99 na isopropyl barasa.

Zan iya amfani da injin tsabtace ruwa don tsotse karfen ruwa da ya zube daga uwata?¶

Kada a taɓa bututun tsabtace gida zuwa motherboard, katin zane, ko soket na CPU don tsaftace ƙarfe mai ruwa. Iska mai saurin tafiya da sauri ta cikin bututun ƙarfe na filastik yana haifar da dubban volts na Electrostatic Discharge (ESD) wanda zai iya lalata transistor na CMOS cikin shiru, yayin da babban saurin tsotsawa ya fashe madaidaicin saman-Mount capacitors ko LGA soket fil daga kan allo kuma ya watsar da ƙarfe mai zurfi cikin ramummuka. Koyaushe yi amfani da tsotsa mai ƙananan gudu tare da ƙaramin sirinji na filastik da rigar kashi 99 na isopropyl barasa.

Na yi da gangan akan PC ko kwamfutar tafi-da-gidanka tare da zubewar ƙarfe na ruwa kuma nan da nan ya kashe. Shin ya mutu na dindindin?¶

Ba lallai ba ne, saboda samar da wutar lantarki na zamani da na'urorin sarrafa wutar lantarki na motherboard (VRMs) sun ƙunshi kayan aikin Kariya kan-Yanzu (OCP) da Kariyar Gajerun Kewaye (SCP) waɗanda ke tafiya cikin daƙiƙai lokacin da jirgin ƙasa ya gajarta ƙasa. Nan da nan zazzage wutar lantarki da baturi, cire kowane nau'in ƙarfe na ruwa ta amfani da ka'idar isopropyl barasa kashi 99 cikin 100, bari allon ya bushe na sa'a ɗaya, sannan a gwada gajerun hanyoyin capacitor tare da multimeter kafin ƙoƙarin sake yin taya.

Menene mafi aminci madadin zubewar sifili zuwa ƙarfe na ruwa wanda ke yin kusan kuma akan GPU mara amfani da kwamfutar tafi-da-gidanka ya mutu?¶

Idan kuna son haɓakar zafin jiki da ƙarfin fitar da ƙarfi kusa da ƙarfe na ruwa akan ƙarancin GPU ya mutu, PCs na caca na hannu, ko kwamfyutocin tafi-da-gidanka ba tare da wani haɗarin gajerun hanyoyin lantarki ko lalata aluminium ba, yi amfani da kushin canjin yanayi kamar Honeywell PTM7950 (ko Thermal Grizzly PhaseSheet PTM / KryoSheet graphene pads). Honeywell PTM7950 kashi 100 cikin 100 na wutar lantarki ba shi da ƙarfi, mai ƙarfi a ɗaki don shigarwa cikin sauƙi, kuma yana narkewa cikin babban siriri mai aiki mai ƙarfi sama da digiri 45 na Celsius (digiri 113 Fahrenheit).

Jagora masu alaƙa¶

• An ciro CPU tare da heatsink ko lankwasa socket fil
• Kwamfutar PC ta al'ada da ɗigon ruwan sanyaya ruwa
• GPU artifacting da hardware karo
• PSU capacitor pop, 12VHPWR mai haɗa narke, da ƙanshin wutan lantarki a cikin PC

Tushen da jagorar hukuma¶

• ** IPC (Association Connecting Electronics Industries):** * IPC-7711/7721 Sake Aiki, Gyarawa da Gyaran Majalisun Lantarki* da * IPC-J-STD-001 Abubuwan Bukatu don Taro na Wutar Lantarki * (Dacewar daidaitawa da tarkace daidaitattun abubuwan waje na waje).
• ** Thermal Grizzly GmbH (EC 1907/2006 REACH):** * Gudanar da Gallium-Indium-Tin Eutectic Thermal Compound Safety Data Sheet* (Handling, aluminum incompatibility warnings, and isopropyl barasa tsabtace).
• ** ASM International: ** * Littafin Jagora na ASM Volume 13A: Lalacewa - Liquid Metal Embrittlement (LME) na Aluminum Alloys ta Gallium* (Mashinan Yadawa na hatsi na gallium na ruwa akan aluminum vs. Samuwar tagulla na jan karfe).
• ** Laboratories Underwriters (UL):** * UL 62368-1 Audio/Video, Bukatun Tsaro na Kayan Aikin Sadarwa da Fasahar Sadarwa* (Kariyar gajeriyar kewayawa da ƙa'idodin sharewa na lantarki akan allunan wayoyi da aka buga).
• ** Ƙungiyar Kare Wuta ta Ƙasa (NFPA):** * NFPA 70B Standard for Electrical Equipment Maintenance* (De-energization, solven cleansing safety, and short-circuit risk risk).